Shijo Nagao

The University of Tokyo — Japan

Engineering · Physical Sciences

45h-index6.1kcitations257works0.02yr avg
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Research Topics

Electronic Packaging and Soldering Technologies(116), 3D IC and TSV technologies(72), Aluminum Alloys Composites Properties(39), Nanomaterials and Printing Technologies(32), Copper Interconnects and Reliability(31)

Publications257 total

Dehydration of MgHPO<sub>4</sub>·3H<sub>2</sub>O (newberyite) under low pressure conditions and its implications for the surface thermal history of Ruygu and Bennu
GEOCHEMICAL JOURNAL·2026Open Access
Measurement of Λ Polarization in the <i>π</i>  ¯   <i>p</i> → <i>K</i> 0 Λ Reaction at <i>p</i> π¯ = 1.33 GeV/ <i>c</i> toward a New Λ <i>p</i> Scattering Experiment
Progress of Theoretical and Experimental Physics·2025Open Access
Backward-angle electroproduction of $η'$ mesons off protons at $W=2.13~\text{GeV}$ and $Q^{2}=0.46~\left(\text{GeV}/c\right)^{2}$
arXiv (Cornell University)·2025Open Access
Measurement of $Λ$ Polarization in the $π^{-}p \to K^{0} Λ$ Reaction at $p_{π^{-}}=1.33$ GeV/$c$ toward a New $Λp$ Scattering Experiment
ArXiv.org·2025Open Access
Inclusive studies of two- and three-nucleon short-range correlations in $^3$H and $^3$He
arXiv (Cornell University)·2024Open Access
High accuracy synchrotron radiation interferometry with relativistic electrons
Journal of Physics Conference Series·2023Open Access
<i>In situ</i> nanoelectromechanical characterization of phase transformation in Si phononic crystal during nanoindentation
APL Materials·2021· 1 citedOpen Access
Room-Temperature Plasticity of a Nanosized GaN Crystal
Nano Letters·2021· 11 citedOpen Access
Evaluation of thermal resistance for metalized ceramic substrates using a microheater chip
International Journal of Applied Ceramic Technology·2021· 10 cited
Fracture mechanism of microporous Ag-sintered joint in a GaN power device with Ti/Ag and Ni/Ti/Ag metallization layer at different thermo-mechanical stresses
Journal of Materials Science·2021· 34 cited
Mechanical and electrical analysis in phononic Si crystal
The Japan Society of Applied Physics·2021
Online Thermal Resistance and Reliability Characteristic Monitoring of Power Modules With Ag Sinter Joining and Pb, Pb-Free Solders During Power Cycling Test by SiC TEG Chip
IEEE Transactions on Power Electronics·2020· 77 cited
Real-Time Acoustic Emission Monitoring of Wear-Out Failure in SiC Power Electronic Devices During Power Cycling Tests
IEEE Transactions on Power Electronics·2020· 33 citedOpen Access
Thermal evaluation of metalized ceramic substrates for use in next-generation power modules toward international standardization
2020· 4 citedOpen Access
Reactive wafer bonding with nanoscale Ag/Cu multilayers
Scripta Materialia·2020· 10 cited
Strengthening of DBA substrate with Ni/Ti/Ag metallization for thermal fatigue-resistant Ag sinter joining in GaN power modules
Journal of Materials Science Materials in Electronics·2020· 17 cited
Bonding and High-Temperature Storage Performance of Die Attachment with Ag Paste Sintering on Bare Direct Bonding Aluminum (DBA) Substrate
˜The œminerals, metals & materials series·2020· 1 cited
Mechanical characteristics and fracture behavior of GaN/DBA die-attached during thermal aging: pressure-less hybrid Ag sinter joint and Pb–5Sn solder joint
Journal of Materials Science Materials in Electronics·2019· 42 cited
Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining
Micromachines·2019· 25 citedOpen Access
Effect of W content in Co-W-P metallization on both oxidation resistance and resin adhesion
Journal of Materials Science·2019· 5 cited
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Frequent Co-authors

Katsuaki Suganuma(38), Jinting Jiu(25), Tohru Sugahara(23), Chuantong Chen(14), Masaya Nogi(12), Hirotaka Koga(12), Hao Zhang(10), Hiroshi Uchida(7), Teppei Araki(5), Yue Gao(5), Wanli Li(5), Cai‐Fu Li(5), Hao Zhang(4), Roman Nowak(4), Tomohito Iwashige(4), Kazuhiko Sugiura(4), Kazuhiro Tsuruta(4), Gong Zhang(3), Jianying He(3), Jun Wang(2)