Hsien-Chien Hsieh

National Central University — Taiwan

Materials Science · Physical Sciences

5h-index193citations7works0.02yr avg
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Research Topics

Advanced Thermoelectric Materials and Devices(4), Thermal Radiation and Cooling Technologies(3), Electronic Packaging and Soldering Technologies(2), Thermal properties of materials(2), 3D IC and TSV technologies(2)

Publications7 total

Interfacial Stability in Bi<sub>2</sub>Te<sub>3</sub> Thermoelectric Joints
ACS Applied Materials & Interfaces·2020· 64 cited
Joint properties enhancement for PbTe thermoelectric materials by addition of diffusion barrier
Materials Chemistry and Physics·2020· 27 cited
Co-P Diffusion Barrier for p-Bi2Te3 Thermoelectric Material
Journal of Electronic Materials·2018· 40 cited
Co-sputtered Cu(Ti) thin alloy film for formation of Cu diffusion and chip-level bonding
Materials Chemistry and Physics·2018· 10 cited
Electroless Co-P diffusion barrier for n-PbTe thermoelectric material
Journal of Alloys and Compounds·2017· 48 cited
Effect of phase separation on mechanical strength of co-sputtering Cu(Ti) thin film in chip-level 3DIC bonding
Materials Letters·2016· 2 cited
Si1−xGex photodiode with segregated Ge nanocrystals
Materials Letters·2016· 2 cited

Frequent Co-authors

Albert T. Wu(7), Chun‐Hsien Wang(4), Tian-Wey Lan(2), Yang-Yuan Chen(2), Tse-Hsiao Lee(2), Hsu-Shen Chu(2), Hsin‐Yi Lee(2), Po Chen Lin(2), Hao Chen(2), Tsan-Hsien Tseng(2), Zhen-Wei Sun(1), V.K. Ranganayakulu(1), Ying-Yi Chang(1), Wen-Chih Lin(1), Subhendu Chakroborty(1), Hsin-Yi Lee(1), Yao-Tsung Ouyang(1), Po-Chen Lin(1), Ching‐Shun Ku(1)