U. Troppenz

Fraunhofer Institute for Telecommunications, Heinrich Hertz Institute — Germany

Engineering · Physical Sciences

17h-index2.0kcitations92works0.02yr avg
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Research Topics

Photonic and Optical Devices(71), Semiconductor Lasers and Optical Devices(55), Optical Network Technologies(32), Advanced Photonic Communication Systems(14), Luminescence Properties of Advanced Materials(12)

Publications92 total

Hybrid Integration of Polymer PICs and InP Optoelectronics for WDM and SDM Terabit Intra-DC Optical Interconnects
2023· 4 citedOpen Access
4 x 200 Gb/s EML-Array with a Single MQW Layer Stack
2023· 1 cited
4x 200 Gb/s EML-Array with a Single MQW Layer Stack
2023· 5 citedOpen Access
200 Gb/s Uncooled EML with Single MQW Layer Stack Design
Zenodo (CERN European Organization for Nuclear Research)·2022· 4 citedOpen Access
56 GBd high power InP EAM chip for hybrid integration
2022 28th International Semiconductor Laser Conference (ISLC)·2022
Uncooled 100 GBd O-Band EML for Datacom Transmitter Arrays
Optical Fiber Communication Conference (OFC) 2022·2022· 9 citedOpen Access
Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements
Scientific Reports·2021· 53 citedOpen Access
InP-Components for 100 GBaud Optical Data Center Communication
Photonics·2021· 9 citedOpen Access
Designs break bandwidth record
Nature Photonics·2020· 2 cited
Liquid crystal filter based tunable transmitter for 25Gps wavelength division multiplexing-passive optical network fronthaul
Optics Express·2020· 4 citedOpen Access
3D-printed optical probes for wafer-level testing of photonic integrated circuits
Optics Express·2020· 28 citedOpen Access
Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography
Light Science & Applications·2020· 159 citedOpen Access
Integrated transmitter devices on InP exploiting electro-absorption modulation
PhotoniX·2020· 24 citedOpen Access
Enabling low-cost high-volume production compatible terabit transceivers with up to 1.6 Tbps capacity and 100Gbps per lane PAM-4 modulation for intra-data center optical interconnects up to 2km: The TERIPHIC project approach
2020· 7 cited
InP/Silicon Hybrid External-Cavity Lasers (ECL) Using Photonic Wirebonds as Coupling Elements
2020· 5 citedOpen Access
Novel concept for VCSEL enhanced silicon photonic coherent transceiver
AIP Advances·2019· 4 citedOpen Access
Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding
Optica·2018· 275 citedOpen Access
In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration
Nature Photonics·2018· 371 cited
In-Situ 3D Nano-Printing of Freeform Coupling Elements for Hybrid Photonic Integration
arXiv (Cornell University)·2018· 15 citedOpen Access
4 × 56 Gb/s High Output Power Electroabsorption Modulated Laser Array With up to 7 km Fiber Transmission in L-Band
Journal of Lightwave Technology·2017· 21 cited
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Frequent Co-authors

Martin Moehrle(18), Martin Schell(14), Muhammad Rodlin Billah(12), W. Freude(12), C. Koos(12), Philipp‐Immanuel Dietrich(11), Matthias Blaicher(11), T. Hoose(10), J. Kreissl(10), Michael Theurer(10), Andreas Hofmann(8), Michael Hamacher(8), H. Heidrich(8), Pablo Marin-Palomo(6), Sebastian Randel(6), W. Rehbein(6), Dominik G. Rabus(6), R.H. Mauch(6), G. Przyrembel(6), Ariane Sigmund(6)