Shlomo Shlafman

Technion – Israel Institute of Technology — Israel

Physics and Astronomy · Physical Sciences

7h-index104citations17works0.02yr avg
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Research Topics

Mechanical and Optical Resonators(7), Advanced MEMS and NEMS Technologies(6), Radio Frequency Integrated Circuit Design(5), Electromagnetic Compatibility and Noise Suppression(5), Carbon Nanotubes in Composites(4)

Publications17 total

Theoretical modelling of arch-shaped carbon nanotube resonators exhibiting Euler–Bernoulli snap-through bi-stability
Nonlinear Dynamics·2023· 10 cited
Mode coupling bi-stability and spectral broadening in buckled carbon nanotube mechanical resonators
Nature Communications·2022· 19 citedOpen Access
DC Signature of Snap-through Bistability in Carbon Nanotube Mechanical Resonators
Nano Letters·2022· 8 citedOpen Access
DC Signature of snap-through bi-stability in carbon nanotube resonators
arXiv (Cornell University)·2022· 1 citedOpen Access
Theoretical modelling of arch-shaped carbon nanotube resonators exhibiting Euler-Bernoulli snap-through bi-stability
arXiv (Cornell University)·2022· 3 citedOpen Access
Mode coupling, bi-stability, and spectral broadening in buckled nanotube resonators
arXiv (Cornell University)·2021· 1 citedOpen Access
Snap-Through Buckling Bi-Stability in Suspended Carbon Nanotube Resonators
Bulletin of the American Physical Society·2019
Automated circuit fabrication and direct characterization of carbon nanotubes vibrations - Optical imaging of CNTs
Bulletin of the American Physical Society·2018
Automated circuit fabrication and direct characterization of carbon nanotube vibrations
Nature Communications·2016· 14 citedOpen Access
Variable Delay Transmission Lines in advanced CMOS SOI technology
2014· 9 cited
Characterization of TSV-Induced Loss and Substrate Noise Coupling in Advanced Three-Dimensional CMOS SOI Technology
IEEE Transactions on Components Packaging and Manufacturing Technology·2013· 14 cited
TSV multi-signal connection compact modeling
2013
A 60GHz, linear, direct down-conversion mixer with mm-Wave tunability in 32nm CMOS SOI
2013· 4 cited
Variable transmission lines: Structure and compact modeling
2011· 2 cited
Design and Modeling Methodology of Vertical Interconnects for 3DI Applications
IEEE Transactions on Components Packaging and Manufacturing Technology·2011· 12 cited
On-chip CMOS coplanar transmission line measurements and model verification up to 50 GHz
2008
Silicon-chip single and coupled coplanar transmission line measurements and model verification up to 50GHz
2007· 7 cited

Frequent Co-authors

Sharon Rechnitz(9), Tal Tabachnik(9), Michael Shlafman(9), Yuval Yaish(9), Benny Sheinman(6), D. Goren(5), Danny Elad(5), Rachel Gordin(3), Alberto Valdes‐Garcia(3), Gilad Zeevi(2), Zeev Rogachevsky(2), Israel Goldshtein(2), Xiaoxiong Gu(2), Anthony Young(2), Mihai Sanduleanu(2), Wayne Woods(2), J. Rascoe(2), Noam Gordon(1), G. Alchanati(1), Maor Itzhak(1)