Hongjun Ji

Shenzhen Institute of Information Technology — China

Engineering · Physical Sciences

33h-index4.1kcitations178works5.32yr avg
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Research Topics

Electronic Packaging and Soldering Technologies(65), Advanced Welding Techniques Analysis(40), 3D IC and TSV technologies(31), Advanced Sensor and Energy Harvesting Materials(27), Aluminum Alloys Composites Properties(22)

Publications177 total

The impact of temperature on microstructure and mechanical properties of Kovar/Al2O3 joints using Bi-B-Zn-Si glass solder
Ceramics International·2025
Ligand‐Engineered Cu@Ni Core‐Shell Nanoparticles with Excellent Performance for Printed Electronics
Advanced Materials Technologies·2025
Ultrasonic-assisted wetting behaviors of Sn solder on (111) nano-twinned Cu electroplating films for UBM
2025
CuAgSnIn composite joints with rapid bonding and high shear strength for power electronic packaging
2025
Direct Low-temperature Sintering of Cu Nanoparticles on Laser-metallized AlN Ceramics by UV Nanosecond Laser
2025
Achieving ultrahigh-strength Cu sintering joints prepared by ultrasonic spraying of thin Cu nanoparticle films
Journal of Materials Processing Technology·2025
Bio‐Inspired Structural Color Irises as Physical Unclonable Functions for Anti‐Counterfeiting
Advanced Science·2025· 3 citedOpen Access
Analysis and optimization of dielectric properties of cordierite-based glass composites for advanced LTCC applications
Ceramics International·2025
Temperature dependence of tensile deformation behaviors in a novel powder metallurgy Ni-based superalloy with high density nanoscale γ′ phase
Materials Science and Engineering A·2025· 2 cited
Optimizing Selective Laser Melting of a High-Alloyed Ni-Based Superalloy: Achieving Crack-Free Fabrication with Enhanced Microstructure and Mechanical Properties
Acta Metallurgica Sinica (English Letters)·2025· 1 cited
Mechanical reinforcement of silver films on Si3N4 substrates via a novel Bi2O3-B2O3-ZnO-TeO2 glass frit
Journal of Alloys and Compounds·2025· 1 cited
Additively Manufactured Micro-Pyramid Structured Electronic Skin with [BMIM]BF<sub>4</sub> 3D Morphology Detection at Low Temperature
ACS Applied Electronic Materials·2025· 1 cited
Development of an Antioxidation Copper Paste with Self-Reducing Copper Formate and Molecular Dynamics Analysis of Sintering Mechanisms
Acta Metallurgica Sinica (English Letters)·2025· 2 cited
Precision printing and control of total internal reflection structural colors: Applications in anti-counterfeiting and color blindness detection
Journal of Colloid and Interface Science·2025· 2 cited
Bioinspired cilia-based electronic skin for multimodal mechanical sensing via additive manufacturing
Soft Science·2025· 2 citedOpen Access
Improving the weldability and mechanical property of ultrasonic spot welding of Cu sheets through a surface gradient structure
Journal of Materials Research and Technology·2025· 49 citedOpen Access
A fabrication strategy of nanotwinned metals with superior manufacturability and weldability for electronic packaging
The Innovation Materials·2025Open Access
Mechanical Reinforcement of Silver Films on Si3N4 Substrates Via a Novel Bi2o3-B2O3-Zno-Teo2 Glass Frit
SSRN Electronic Journal·2025Open Access
Additively Manufactured Flexible EGaIn Sensor for Dynamic Detection and Sensing on Ultra-Curved Surfaces
Sensors·2024· 1 citedOpen Access
Effect of sputtering power on the microstructure and properties of silver films prepared by magnetron sputtering
Materials Today Communications·2024· 6 cited
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Frequent Co-authors

Mingyu Li(38), Weiwei Zhao(11), Chunqing Wang(8), Huanhuan Feng(7), Xing Ma(5), Hongtao Chen(4), Jiaheng Zhang(4), Jongmyung Kim(4), Qiuchen Ma(4), Hao Pan(3), Jun Wei(3), Wenbo Zhu(3), Shaowei Hu(3), Jun Wei(3), Jiayi Huang(3), Wenwu Zhang(3), Han Sur Bang(3), Li Yin(2), Fan Yang(2), Qian Zhang(2)