Alison Gracias

Atotech (United States) — United States

Engineering · Physical Sciences

5h-index144citations20works0.02yr avg
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Research Topics

3D IC and TSV technologies(7), Electronic Packaging and Soldering Technologies(6), Photonic and Optical Devices(3), Silicon Nanostructures and Photoluminescence(3), Semiconductor materials and devices(2)

Publications20 total

Electrolytic Cobalt Fill of Sub-5 nm Node Interconnect Features
2018· 9 cited
Impact of Bath Stability on Electroplated Cu for TSVs in a Controlled Environment
Journal of Microelectronics and Electronic Packaging·2015· 1 citedOpen Access
Impact of Bath Stability on Electroplated Cu for Through-Silicon-Vias (TSV) in a Controlled Manufacturing Environment
IMAPSource Proceedings·2014
SHORT LOOP ELECTRICAL AND RELIABILITY LEARNING FOR THROUGH SILICON VIA (TSV)MID-WAFER FRONT-SIDE PROCESSES
IMAPSource Proceedings·2014· 2 cited
Cost Analysis of TSV Process and Scaling Options
IMAPSource Proceedings·2014· 1 citedOpen Access
Thermo-mechanical and electrical characterization of through-silicon vias with a vapor deposited polyimide dielectric liner
2012· 4 cited
One-dimensional self-assembly of mouse embryonic stem cells using an array of hydrogel microstrands
Biomaterials·2011· 65 citedOpen Access
Influence of diamond nanoparticles on the thermal properties of benzocyclobutene (BCB)
physica status solidi (a)·2010· 12 cited
SU-8 microfluidic channels with porous sidewalls for biological applications
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2009· 1 cited
A novel optical component for the development of an integrated interferometric system
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2009· 3 cited
Direct Cell Printing With Microfabricated Quill-Pen Cantilevers
MRS Proceedings·2009· 5 cited
SU8-based static diffractive optical elements: wafer-level integration with VCSEL arrays
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2008· 9 cited
A porous silicon thermally tunable optical filter
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2008
A living cell-based biosensor utilizing G-protein coupled receptors: Principles and detection methods
Biosensors and Bioelectronics·2007· 21 cited
Porous silicon 2D photonic crystals
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2007· 2 cited
Life on a chip: nanobioscience R & D at CNSE
Nanomedicine Nanotechnology Biology and Medicine·2006
Novel spatially distributed porous Si optical bandpass filters
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2006· 2 cited
Wafer bonding for 3D integration of MEMS/CMOS
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2006· 1 cited
Microfabricated devices for bio-applications
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2005· 3 cited
Reliability study of wafer bonding for micro-electro-mechanical systems
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2004· 3 cited

Frequent Co-authors

James Castracane(12), Natalya Tokranova(11), Fred Wafula(5), Gyanaranjan Pattanaik(4), Jack Enloe(4), Xiaojun Feng(3), Ben G. Szaro(3), Brian Sapp(3), Kaoru Maekawa(3), Xu Bai(3), Nurazhani Abdul Raof(2), Michael R. Padgen(2), Magnus Bergkvist(2), Yubing Xie(2), Nathaniel C. Cady(2), Bo Xu(2), Da In Song(2), Victor Vartanian(2), Klaus Hummler(2), Steve Olson(2)