Elie Najjar

Alpha and Omega Semiconductor (United States) — United States

Engineering · Physical Sciences

3h-index29citations19works0.52yr avg
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Research Topics

Electronic Packaging and Soldering Technologies(9), 3D IC and TSV technologies(8), Copper Interconnects and Reliability(8), Electrodeposition and Electroless Coatings(6), Corrosion Behavior and Inhibition(2)

Publications19 total

Effect of Grain Size on Cu-Cu Bonding Quality for Fine-Pitch Hybrid Bonding Application
2025
Metastable Fine Grain Cu for Hybrid Bonding Applications
IMAPSource Proceedings·2025Open Access
Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding
IMAPSource Proceedings·2024Open Access
Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding
Journal of Microelectronics and Electronic Packaging·2024· 2 citedOpen Access
A high-uniformity, high-purity copper pillar ECP process with limited acid concentration
IMAPSource Proceedings·2023Open Access
Recent Advances in Electrodeposition of Copper Ultrathin Films on Cobalt Substrate
ECS Meeting Abstracts·2022
Pulmonary function after thoracoplasty for adolescent idiopathic scoliosis: a systematic review and meta-analysis
European Spine Journal·2022· 9 cited
80. Early mobilization after incidental durotomy: a systematic review
The Spine Journal·2022· 2 cited
Early mobilization after incidental durotomy: A systematic review
Brain and Spine·2022Open Access
Electrochemical Plating of Nano-Twinned Cu for WLP Applications
2020· 2 cited
Electrochemical Plating of Nano-Twinned Cu for WLP Applications
Wafer-Level Packaging Symposium·2020
Versatile Electrochemical Plating Process Development for Heterogeneous WLP Structures
2020· 3 cited
(Invited) Cobalt Damascene Chemistry for Advanced Interconnect
ECS Meeting Abstracts·2019
The impact of mascots on Lebanese market branding strategies
2019
Cu Pillar, RDL and Via Fill Challenges facing FOWLP
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)·2017
Advanced thin copper electroplating process for HDI microvia filling application
2013· 2 cited
Electroplating through holes with different geometry -- A novel and high productivity process for through hole fill plating
2012· 6 cited
Electroplating equipment design considerations for copper microvia filling
2009
Next Generation Electroplating Process for HDI Microvia Filling and Through Hole Plating
2008· 3 cited

Frequent Co-authors

Kyle Whitten(8), Pingping Ye(7), Jianwen Han(5), Stephan Braye(5), Mark Lefebvre(4), Thomas J. Richardson(4), Adam Letize(4), Thomas Richardson(4), Leon Barstad(3), Jianwen Han(3), Veronica Hayes(3), Harshul S. Khanna(3), Stephan Braye(2), L. Béjar(2), Rich Hurtubise(2), Vishal Kumar(1), Arvind Vatkar(1), Vishnu Baburaj(1), Parth Bansal(1), N. Jayaraju(1)