Vikram Jandhyala

University of Washington — United States

Physics and Astronomy · Physical Sciences

24h-index1.9kcitations170works0.02yr avg
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Research Topics

Electromagnetic Scattering and Analysis(90), Electromagnetic Simulation and Numerical Methods(81), Advanced Antenna and Metasurface Technologies(49), Electromagnetic Compatibility and Noise Suppression(46), Microwave Engineering and Waveguides(27)

Publications170 total

Optimized Parallel Label Propagation Based Community Detection on the Intel(R) Xeon Phi(TM) Architecture
2015· 2 cited
Assessing strategies for controlling viral rumor propagation on social media - a simulation approach
2015· 5 cited
Simulating context-driven activity cascades in online social networks on the google exacycle platform
2014· 2 cited
Artificial neural network techniques for power and signal integrity
2014
An activity-based information-theoretic annotation of social graphs
2014· 7 cited
Capturing signatures of anomalous behavior in online social networks
2013
PHYSENSE: Scalable sociological interaction models for influence estimation on online social networks
2013· 8 cited
A Variant of Parallel Plane Sweep Algorithm for Multicore Systems
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems·2013· 15 cited
Session details: The next wave: top challenges in electromagnetic-based design automation
2012
Design strategies for high-dimensional electromagnetic systems
2012
Simulation-based design of high dimensional electromagnetic systems
2012
A partial homomorphic encryption scheme for secure design automation on public clouds
2012· 6 cited
High-dimensional electromagnetic design sensitivity
2012· 1 cited
Large orthogonal array-based optimization for high-dimensional parametric systems
2012
On securing green's function-based field simulation on public computing clouds
2012· 1 cited
Wave operators and Green's functions on random graphs
2012· 2 cited
System-level SoC near-field (NF) emissions: Simulation to measurement correlation
2012· 4 cited
Return-Path Extraction Technique for SSO Analysis of Low-Cost Wire-Bonding BGA Packages
IEEE Transactions on Components Packaging and Manufacturing Technology·2012· 4 cited
Moore meets Maxwell
Design, Automation, and Test in Europe·2012· 1 cited
Moore meets maxwell
2012· 2 cited
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Frequent Co-authors

Dipanjan Gope(17), Leung Tsang(8), Eric Michielssen(7), Albert E. Ruehli(6), Yong Wang(5), Chuanyi Yang(4), B. Shanker(3), Chung‐Chi Huang(3), C.‐J. Richard Shi(3), R. Mittra(3), S. Chakraborty(3), Weng Cho Chew(2), Houfei Chen(2), Sumit Roy(2), Ritochit Chakraborty(2), Chi Hou Chan(2), Qin Li(2), Peng Xu(2), Xiren Wang(2), Indranil Chowdhury(2)