M. Waelti

University of Zurich — Switzerland

Engineering · Physical Sciences

11h-index601citations17works0.02yr avg
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Research Topics

Advanced MEMS and NEMS Technologies(8), Photonic and Optical Devices(5), Mechanical and Optical Resonators(4), Electronic Packaging and Soldering Technologies(3), Plant and animal studies(3)

Publications17 total

How to be an attractive male: floral dimorphism and attractiveness to pollinators in a dioecious plant
BMC Evolutionary Biology·2009· 83 citedOpen Access
Floral odour and reproductive isolation in two species of <i>Silene</i>
Journal of Evolutionary Biology·2007· 130 cited
Food supply modifies the trade-off between past and future reproduction in a sexual parasite–host system (Rana esculenta, Rana lessonae)
Oecologia·2007· 23 citedOpen Access
Postpollination Changes in Floral Odor in Silene latifolia: Adaptive Mechanisms for Seed-Predator Avoidance?
Journal of Chemical Ecology·2006· 61 citedOpen Access
Single-crystal silicon micromirror array with polysilicon flexures
Sensors and Actuators A Physical·2005· 20 cited
Two-Axis Single-Crystal Silicon Micromirror Arrays
Journal of Microelectromechanical Systems·2004· 21 cited
Electromagnetically Actuated Mirror Arrays for Use in 3-D Optical Switching Applications
Journal of Microelectromechanical Systems·2004· 85 cited
Pull-in suppression and torque magnification in parallel plate electrostatic actuators with side electrodes
2004· 15 cited
977 Electrical Contact Resistance as a Diagnostic Tool for MEMS Contact
2004· 1 cited
Electrostatic micromirror arrays fabricated with bulk and surface micromachining techniques
2003· 11 cited
Bulk micromachined electrostatic beam steering micromirror array
IEEE/LEOS International Conference on Optical MEMS·2003· 10 cited
Component Failure Analysis in MEMS Packaging
Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology·2002· 1 cited
Plastic BGA Package and Direct Filter Attachment for CMOS Thermal Imagers
2001· 2 cited
Uncooled low-cost thermal imager based on micromachined CMOS integrated sensor array
Journal of Microelectromechanical Systems·2001· 96 cited
Packaging of CMOS MEMS
Microelectronics Reliability·2000· 21 cited
Fluxless Microjoining by Au-In-Ni Isothermal Solidification
MRS Proceedings·1999· 8 cited
Package Quality Testing Using Integrated Pressure Sensor
SPIE eBooks·1998· 13 cited

Frequent Co-authors

Carlos H. Mastrangelo(6), A. Pareek(5), C.D. Fung(5), Oliver Brand(4), Alex Widmer(3), Florian P. Schiestl(3), N. Schneeberger(3), Mehmet R. Dokmeci(3), T.D. Kudrle(3), C.C. Wang(3), Mirela G. Bancu(3), James C. Hsiao(3), G. Kirkos(3), Joëlle K. Mühlemann(2), A. Schaufelbühl(2), H. Baltes(2), Soovadeep Bakshi(2), T. Shone(2), H.P. Baltes(2), U. Münch(1)