Andrew J. Kerman

MIT Lincoln Laboratory — United States

Computer Science · Physical Sciences

34h-index6.3kcitations153works0.02yr avg
OpenAlex↗ORCID↗Google Scholar↗Lab page↗

Accepting Students?

No reports yet. Know if this professor is taking students?

Research Topics

Quantum Information and Cryptography(59), Quantum and electron transport phenomena(41), Quantum Computing Algorithms and Architecture(33), Cold Atom Physics and Bose-Einstein Condensates(32), Atomic and Subatomic Physics Research(22)

Publications153 total

Quantum dynamics of semiconductor quantum dot Josephson junctions
Physical review. B./Physical review. B·2025Open Access
Superconducting-Semiconducting Voltage-Tunable Qubits in the Third Dimension
Physical Review Applied·2023
Demonstration of Tunable Three-Body Interactions between Superconducting Qubits
Physical Review Letters·2022· 32 cited
Distinguishing Multispin Interactions from Lower-Order Effects
Physical Review Applied·2022· 7 cited
Demonstration of long-range correlations via susceptibility measurements in a one-dimensional superconducting Josephson spin chain
npj Quantum Information·2022· 7 citedOpen Access
Demonstration of tunable three-body interactions between superconducting qubits
arXiv (Cornell University)·2022Open Access
Superconducting-semiconducting voltage-tunable qubits in the third dimension
arXiv (Cornell University)·2022Open Access
Distinguishing multi-spin interactions from lower-order effects
arXiv (Cornell University)·2021Open Access
Demonstration of long-range correlations via susceptibility measurements in a one-dimensional superconducting Josephson spin chain
arXiv (Cornell University)·2021Open Access
Towards a 4-local coupler for superconducting flux qubits - part 2: distinguishing multi-spin interactions from lower-order effects
Bulletin of the American Physical Society·2021
Towards a 4-local coupler for superconducting flux qubits – Part 1: Quantum landscape engineering of the ground state
Bulletin of the American Physical Society·2021
High-density I/O for next-generation quantum annealing: Part 1—Cryogenic wiring
Bulletin of the American Physical Society·2021· 2 cited
High-density I/O for next-generation quantum annealing: Part 2—Device packaging
Bulletin of the American Physical Society·2021
3D integration of superconducting quantum systems – part 2: Interposer tier with superconducting TSVs and qubits
Bulletin of the American Physical Society·2021
Multi-spin chain gadget with exponentially small gap controlled by a single spin
Bulletin of the American Physical Society·2021
3D integration of superconducting quantum systems – part 3: Preserving qubit coherence
Bulletin of the American Physical Society·2021
3D integration of superconducting quantum systems – part 1: 3-tier design and connectivity
Bulletin of the American Physical Society·2021
Fabrication of superconducting through-silicon vias
arXiv (Cornell University)·2021· 17 citedOpen Access
Coherent oscillations in diabatic quantum annealing schedules
Bulletin of the American Physical Society·2021
Automated design of superconducting circuits and its application to 4-local couplers
npj Quantum Information·2021· 30 citedOpen Access
page 1 of 8Next →

Frequent Co-authors

Eric A. Dauler(20), Karl K. Berggren(14), Joel K. W. Yang(11), Vladan Vuletić(10), Cheng Chin(10), R. J. Molnar(10), Vikas Anant(9), Steven Chu(9), William D. Oliver(8), Danna Rosenberg(7), Bryan S. Robinson(7), Jonilyn Yoder(6), Matthew E. Grein(6), Simon Gustavsson(5), Kristine M. Rosfjord(5), Alán Aspuru‐Guzik(5), David Hover(4), Jeremy Sage(4), D. Rosenberg(4), Scott A. Hamilton(4)