Vincenzo Vinciguerra

University of Catania — Italy

Engineering · Physical Sciences

23h-index2.6kcitations90works0.92yr avg
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Research Topics

Advanced Sensor and Energy Harvesting Materials(17), Advanced Surface Polishing Techniques(15), Silicon Carbide Semiconductor Technologies(13), Thin-Film Transistor Technologies(13), Electronic Packaging and Soldering Technologies(12)

Publications90 total

An Accurate Empirical Determination of the Mass of the Electron from Properties of the W Boson Vector
Preprints.org·2025Open Access
Semiconductor manufacturing wastewater challenges and the potential solutions via printed electronics
iScience·2025· 2 citedOpen Access
Finite Element Analysis of the Mechanical Influence of a Frictionless Contact in a Simulated Ball-on-Ring System
2025
Finite Element Analysis of the Asymmetric Warpage Induced by the Oxidation Process in Trench Insulated Gate Bipolar Transistor (Trench IGBT) 12” Si Patterned Wafers
2025· 1 cited
Finite Element Analysis of Warpage Hysteresis Loop Evolution and Bifurcation in Thinned 4H-SiC Cu_ECD Metalized Wafers
2025
A Comparison of Analytical and Finite Element Analysis Methods for Determining the Equivalent Thickness of Large 4H-SiC Taiko Wafers
2024
Extension of the Equivalent Thickness Concept to the Bifurcation of Large Semiconductor Front Side Metal Taiko Wafer investigated by ANSYS Finite Element Analysis Methods
2024· 1 cited
Finite Element Analysis of the Upsurge of Bifurcation during the Thinning Process of Large Semiconductor Wafers
2024· 3 cited
Finite Element Analysis of the Upsurge of Bifurcation during the Thinning Process of Large Semiconductor Wafers
Preprints.org·2024Open Access
Extension of the Equivalent Thickness Concept to the Bifurcation of Large Semiconductor Front Side Metal Taiko Wafers Investigated by Ansys Finite Element Analysis Methods
Preprints.org·2024· 2 citedOpen Access
A Comparative Study of Analytical and Finite Element Analysis Numerical Approaches of the Equivalent Thickness of Large 4H-SiC Taiko Wafers
2023· 5 citedOpen Access
Determination of the Equivalent Thickness of a Taiko Wafer Using ANSYS Finite Element Analysis
Applied Sciences·2023· 6 citedOpen Access
Determination of the Equivalent Thickness of a Taiko Wafer using ANSYS Finite Elements Analysis
Preprints.org·2023· 1 citedOpen Access
Investigating the Occurrence of Bifurcation in Large Metalized Wafers using ANSYS Layered Shell Elements
2023· 11 cited
Models of Bifurcation and Gravity Induced Deflection in Wide Band Gap 4H-SiC Semiconductor Wafers
2023· 8 cited
Electro-Thermo-Mechanical Simulation Analysis and Optimization of SiC Power MOSFET under UIS Test Condition
2022
Failure Strength Analysis and Young Modulus Assessment of 4H-SiC through a Ball on Ring Test
2022· 3 cited
Wafer Bifurcation as a Spontaneous Symmetry Breaking
2022· 10 cited
Models of Bifurcation in a Semiconductor Wafer: A Comparison of the Analytical Solution vs. the ANSYS Finite Element Analysis
2022· 12 cited
From Wafer Bifurcation to Warpage Die: a Correlation Method to determine the Warpage of a Metal-Coated Silicon Substrate
2022· 16 cited
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Frequent Co-authors

Ravinder Dahiya(8), F. Priolo(8), G. Franzò(8), Leandro Lorenzelli(7), Luigi G. Occhipinti(7), Giuseppe Luigi Malgioglio(7), Antonio Landi(7), F. Iacona(6), Antonio Maria Chiarelli(6), Arcangelo Merla(6), G. Fallica(6), Wenting Dang(5), David Perpetuini(5), Angelo Messina(5), Marco Renna(5), G. Fortunato(4), Sergio Rinella(4), Francesco Bianco(4), Vincenzo Perciavalle(4), Sabina Gallina(4)