Xin Yang

Hunan University — China

Engineering · Physical Sciences

23h-index1.7kcitations133works4.72yr avg
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Research Topics

Silicon Carbide Semiconductor Technologies(51), Radio Frequency Integrated Circuit Design(26), Electromagnetic Compatibility and Noise Suppression(22), Multilevel Inverters and Converters(13), Advancements in Semiconductor Devices and Circuit Design(12)

Publications133 total

High-voltage cable explosion-proof joint leakage hole size design
2025
The corona loss and audible noise characteristics of rime-covered conductors formed in different positive DC electric field strength
Electric Power Systems Research·2025
Current Balancing and Voltage Oscillation Suppression of Parallel SiC MOSFETs With Compact Coupled Inductors
IEEE Journal of Emerging and Selected Topics in Power Electronics·2025
Structural and electronic properties of hydrogen-terminated diamond field-effect transistors with h-BN gate dielectric featuring native point defects
Applied Physics Letters·2025
Development of A Novel Analytical Trapped Charge Model for Total Ionizing Dose Effects of SiC MOSFETs
2025
Theoretical Study on the Interface and Transport Properties of Ti₃AuC₂ MAX Phase/4H-SiC Heterostructures for High-Temperature Power Device Applications
IEEE Transactions on Electron Devices·2025· 2 cited
Dynamic Uncertainty Estimation for Offline Reinforcement Learning
Proceedings of the AAAI Conference on Artificial Intelligence·2025Open Access
Direct Measurement of Topological Invariants through Temporal Adiabatic Evolution of Bulk States in the Synthetic Brillouin Zone
Physical Review Letters·2025· 8 cited
High-Efficiency Broadband Electroacoustic Energy Conversion Using Non-Foster-Inspired Circuit and Adaptively Switched Capacitor
IEEE Transactions on Industrial Electronics·2025· 19 cited
Improved Cauer Thermal Network Model Considering Lateral Boundary Heat Flux
IEEE Journal of Emerging and Selected Topics in Power Electronics·2025
Dc Electric Field Strength Effects on Positive Corona Loss and Audible Noise Characteristics in Energized Rime-Covered Conductors
SSRN Electronic Journal·2025Open Access
A Unified Physical PSPICE Model of SiC MOSFET With Automatic Parameter Extraction
IEEE Journal of Emerging and Selected Topics in Power Electronics·2024· 2 cited
Novel Prognostics for IGBTs Using Wire-Bond Contact Degradation Model Considering On-Chip Temperature Distribution
IEEE Transactions on Power Electronics·2024· 22 cited
Highly Integrated Two-Port Rectenna System for Wirelessly Powering Multisite Autonomous Vascular Implantable Networks
IEEE Transactions on Microwave Theory and Techniques·2024· 6 citedOpen Access
Thermal Analysis of Giant Magnetostrictive Transducer Based on Stress-Independent Electromagnetic-Thermal Coupling Modeling
IEEE Sensors Journal·2024· 3 cited
Hybrid beamforming for ISAC based on mmWave cell-free MIMO
Xibei Gongye Daxue Xuebao/Journal of Northwestern Polytechnical University·2024Open Access
A Controllable T-Type Broadband Impedance Matching Network for Ultra-Low Frequency Electroacoustic Transducers
IEEE Transactions on Power Electronics·2024· 9 cited
Digital non-Foster-inspired electronics for broadband impedance matching
Nature Communications·2024· 40 citedOpen Access
Investigation on reproduction of IGBT die-attach solder degradation with finite element thermal-mechanical simulation
2024· 1 cited
Transient Analysis of Proportional-Resonant-Controlled Inverters for Dynamic Load
2024
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Frequent Co-authors

Xinlong Wu(12), Guoyou Liu(12), Zhiqiang Long(8), Patrick Palmer(7), Yifei Ding(7), Ke Heng(7), Mengwei Xu(6), Zhihe Zhang(6), Jun Wang(5), Junjie Ye(5), Xingyu Dai(4), Jingfang Ding(4), Yukai Chen(4), Ziru Wang(3), Shuxun Li(3), Yuanhong Zhang(3), Min Guan(3), Ye Yuan(2), Xueqiang Zhang(2), Xue‐Feng Zhu(2)