Vincent Omarjee

Air Liquide (United States) — United States

Engineering · Physical Sciences

5h-index100citations20works0.02yr avg
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Research Topics

Semiconductor materials and devices(15), Copper Interconnects and Reliability(10), Catalytic Processes in Materials Science(4), Electronic and Structural Properties of Oxides(3), Metal and Thin Film Mechanics(2)

Publications20 total

Scaling of Copper Seed Layer Thickness Using Plasma-Enhanced ALD and Optimized Precursors
IEEE Transactions on Semiconductor Manufacturing·2012· 6 cited
Copper-ALD Seed Layer as an Enabler for Device Scaling
ECS Transactions·2011· 2 cited
Copper-ALD Seed Layer as an Enabler for Device Scaling
ECS Meeting Abstracts·2011Open Access
Scaling of copper seed layer thickness using plasma-enhanced ALD and an optimized precursor
2011· 1 cited
Low-k etching using CF<inf>3</inf>I, a path to overcome current BEOL integration issues
2011
Room Temperature Copper Seed Layer Deposition by Plasma-Enhanced Atomic Layer Deposition
ECS Transactions·2011· 2 cited
Room Temperature Copper Seed Layer Deposition by Plasma-Enhanced Atomic Layer Deposition
ECS Meeting Abstracts·2011Open Access
Comparison of HfSiO<sub>x</sub> Thin Films Deposited by ALD with Moisture Using Different Silicon Sources
ECS Transactions·2010· 2 cited
Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD
ECS Transactions·2010· 6 cited
Development of Lanthanide Precursors as Dopants for Advanced High-k Materials
ECS Transactions·2010· 4 cited
Comparison of HfSiO<sub>x</sub> Thin Film Deposited by ALD with Moisture Using Different Silicon Sources
ECS Meeting Abstracts·2010
Development of Lanthanides Precursors as Dopants for Advanced High-k Materials
ECS Meeting Abstracts·2010Open Access
Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD
ECS Meeting Abstracts·2010· 1 citedOpen Access
Advanced Precursor Development for Sr and Ti Based Oxide Thin Film Applications
ECS Transactions·2009· 23 cited
Sr and Ti Precursor Development for Next Generation Thin Films Applications
ECS Meeting Abstracts·2009Open Access
Low Temperature Copper Deposition by PE-ALD
MRS Proceedings·2009· 1 cited
Tuning of Material and Electrical Properties of Strontium Titanates using Process Chemistry and Composition
ECS Transactions·2008· 10 cited
Ti Source Precursors for Atomic Layer Deposition of TiO2, STO and BST
ECS Transactions·2008· 39 cited
Tuning of Material and Electrical Properties of Strontium Titanates using Process Chemistry and Composition
ECS Meeting Abstracts·2008
Ti Source Precursors for Atomic Layer Deposition of TiO2, STO and BST
ECS Meeting Abstracts·2008· 3 cited

Frequent Co-authors

Christian Dussarrat(21), Eric Eisenbraun(10), Jiajun Mao(9), А. П. Королев(8), Rajesh Katamreddy(6), Benjamin Feist(4), V. Purnachandra Rao(4), Brian Besancon(4), Ziyun Wang(2), Pallem V. Rao(2), Nicolas Blasco(2), Manish Kumar Singh(2), Christos G. Takoudis(2), Clement Lansalot(2), Conan Weiland(2), Clement Lanslot(1), Adam Gildea(1), Justin C. Long(1), Nathan Stafford(1), François Doniat(1)