Scott McCann

Xilinx (United States) — United States

Engineering · Physical Sciences

14h-index451citations34works0.02yr avg
OpenAlex↗ORCID↗Google Scholar↗Lab page↗

Accepting Students?

No reports yet. Know if this professor is taking students?

Research Topics

Electronic Packaging and Soldering Technologies(19), 3D IC and TSV technologies(18), Advanced Multi-Objective Optimization Algorithms(10), Optimal Experimental Design Methods(6), Gaussian Processes and Bayesian Inference(4)

Publications34 total

aphBO-2GP-3B: a budgeted asynchronous parallel multi-acquisition functions for constrained Bayesian optimization on high-performing computing architecture
Structural and Multidisciplinary Optimization·2022· 15 citedOpen Access
Core Cracking in Advanced Organic Substrates Due to Free Edge Effect at Cold Temperatures
IEEE Transactions on Components Packaging and Manufacturing Technology·2021· 3 cited
srMO-BO-3GP: A sequential regularized multi-objective Bayesian optimization for constrained design applications using an uncertain Pareto classifier
Journal of Mechanical Design·2021· 8 citedOpen Access
srMO-BO-3GP: A Sequential Regularized Multi-Objective Constrained Bayesian Optimization for Design Applications
2021· 2 cited
srMO-BO-3GP: A Sequential Regularized Multi-Objective Constrained Bayesian Optimization for Design Applications
2020· 17 citedOpen Access
srMO-BO-3GP: A sequential regularized multi-objective constrained Bayesian optimization for design applications
arXiv (Cornell University)·2020· 1 citedOpen Access
Finite Element Modeling Methodology for Monotonic Bend Test of Flip-Chip BGA Package
2020· 3 cited
Erratum: “sMF-BO-2CoGP: A Sequential Multi-Fidelity Constrained Bayesian Optimization Framework for Design Applications” [ASME J. Comput. Inf. Sci. Eng., 20(3), p. 0031007; DOI: 10.1115/1.4046691]
Journal of Computing and Information Science in Engineering·2020· 1 cited
aphBO-2GP-3B: A budgeted asynchronously-parallel multi-acquisition for known/unknown constrained Bayesian optimization on high-performing computing architecture.
arXiv (Cornell University)·2020· 9 citedOpen Access
aphBO-2GP-3B: A budgeted asynchronous parallel multi-acquisition functions for constrained Bayesian optimization on high-performing computing architecture
arXiv (Cornell University)·2020Open Access
sMF-BO-2CoGP: A Sequential Multi-Fidelity Constrained Bayesian Optimization Framework for Design Applications
Journal of Computing and Information Science in Engineering·2020· 50 citedOpen Access
sBF-BO-2CoGP: A Sequential Bi-Fidelity Constrained Bayesian Optimization for Design Applications
2019· 15 citedOpen Access
Time 0 Void Evolution and Effect on Electromigration
2019· 9 cited
An Assessment of Electromigration in 2.5D Packaging
2019· 14 cited
The Expermental and Numerical Study of Electromigration in 2.5D Packaging
2018· 16 cited
Warpage and Reliability Challenges for Stacked Silicon Interconnect Technology in Large Packages
2018· 42 cited
Use of Birefringence to Determine Redistribution Layer Stresses to Create Design Guidelines to Prevent Glass Cracking
IEEE Transactions on Device and Materials Reliability·2017· 10 cited
Determination of Energy Release Rate Through Sequential Crack Extension
Journal of Electronic Packaging·2017· 4 cited
Analysis of System-Level Reliability of Single-Chip Glass BGA Packages with Advanced Solders and Polymer Collars
2017· 12 cited
A Characterization Method for Interfacial Delamination of Copper/Epoxy Mold Compound Specimens under Mixed Mode I/III Loading
2017· 1 cited
page 1 of 2Next →

Frequent Co-authors

Rao Tummala(13), Suresh K. Sitaraman(9), Anh Tran(8), Vanessa Smet(7), Timothy Wildey(6), Venkatesh Sundaram(6), Mike Eldred(5), Gamal Refai-Ahmed(4), Yan Wang(4), Bhupender Singh(3), Vidya Jayaram(3), Venky Sundaram(3), Raj Pulugurtha(3), Tom Lee(3), Suresh Ramalingam(3), Yoichiro Sato(3), Jiefeng Xu(3), Stephen R. Cain(3), Seungbae Park(3), Robert Visintainer(3)