Kelvin Goh Tim Tiam

Heraeus (Germany)Germany

Engineering · Physical Sciences

1h-index4citations1works0.02yr avg

Accepting Students?

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Research Topics

Electronic Packaging and Soldering Technologies(1), Silicon and Solar Cell Technologies(1), 3D IC and TSV technologies(1)

Publications1 total

Frequent Co-authors

Kenny Chiong Kung Chuan(1), Sylvia Sutiono(1), Balasubramanian Senthil(1), Kang Sung Sig(1), Rath Santosh Kumar(1), Fen Zhang(1), Chan Li -San(1)