Heraeus (Germany) — Germany
Engineering · Physical Sciences
6h-index137citations11works0.02yr avg
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Research Topics
Electronic Packaging and Soldering Technologies(10), 3D IC and TSV technologies(6), Copper Interconnects and Reliability(3), Adhesion, Friction, and Surface Interactions(3), Metal and Thin Film Mechanics(2)
Publications11 total
2012 4th Electronic System-Integration Technology Conference·2012· 7 cited
2010· 31 cited
2010· 52 cited
IMAPSource Proceedings·2010· 3 citedOpen Access
Mechanical properties and microstructure of heavy aluminum bonding wires for power applications
Publication Server of Bonn-Rhein-Sieg University of Applied Sciences (Bonn-Rhein-Sieg University of Applied Sciences)·2009· 4 cited
Local hardening behavior of free air balls and heat affected zones of thermosonic wire bond interconnections
Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)·2009· 4 cited
2007· 4 cited
Frequent Co-authors
Matthias Petzold(4), Johnny Yeung(3), Tobias Mueller(3), M. Mittag(3), Christian Dresbach(3), D. Stephan(2), Georg Lorenz(2), T Müller(2), Horst Clauberg(1), Bob Chylak(1), Nelson Wong(1), F. Wulff(1), Effie Chew(1), Falk Naumann(1), Jan Schischka(1), Steffen Koetter(1), A. Bischoff(1), Sylvia Sutiono(1)