Renaud Gillon

Melexis (Belgium) — Belgium

Engineering · Physical Sciences

16h-index1.2kcitations160works0.02yr avg
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Research Topics

Advancements in Semiconductor Devices and Circuit Design(52), Semiconductor materials and devices(49), Electromagnetic Compatibility and Noise Suppression(45), Silicon Carbide Semiconductor Technologies(44), Electrostatic Discharge in Electronics(30)

Publications160 total

Simulation of an IC Level Radiated Immunity Portable Transmitter Test
2025
EDACurry: A Multi-Language Framework to Create, Translate, and Manipulate Transistor-Level Netlists
2025Open Access
EDACurry: A Multi-Language Framework to Create, Translate, and Manipulate Transistor-Level Netlists
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems·2025Open Access
Analog Fault Simulation: Trends and Perspectives in Analog Hardware Description Languages
2024
Physics-based and Behavioural Models for the Dynamic Response of a TVS Diode
2023· 1 cited
Analog Defect Injection and Fault Simulation Techniques: A Systematic Literature Review
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems·2023· 12 citedOpen Access
Verilog-A Implementation of Generic Defect Templates for Analog Fault Injection
2023· 1 citedOpen Access
A Standalone Graph-Theory Based Tool for Full-Chip ESD Verification
IEEE Transactions on Electromagnetic Compatibility·2022
Investigation on Realistic Stuck-on/off Defects to Complement IEEE P2427 Draft Standard
2022 23rd International Symposium on Quality Electronic Design (ISQED)·2022· 2 cited
High-Frequency Characterization and Parametrized Modeling of DC-Biased Surface-Mount Ferrite Beads for EMI Suppression Applications
IEEE Transactions on Electromagnetic Compatibility·2020· 4 cited
Differential Electro-Optical Equivalent Circuit Model of a Vertical-Cavity Surface-Emitting Laser for Common-Mode Rejection Ratio Estimation
Journal of Lightwave Technology·2019· 1 cited
Chip-Level ESD Verification Using Graph-Theory Based Approach
2019· 1 cited
Common‐mode rejection ratio characterisation of a broadband electro‐optical differential ESD voltage probe
Electronics Letters·2019· 2 citedOpen Access
Frequency-Domain Characterization and Modelling of a Multi-Layer Ceramic Capacitor for RF Applications
2019· 2 cited
Design and Characterization of Bias Tee Used for S-parameter Characterization of Power Inductors
2019· 4 cited
Admittance Parameter Based Lumped Element Model of a VCSEL for Differential Analog Signal Transfer
2019
Measurements for RF Amplifiers, Bond Wire Fusing and MOS Power Cells
Mathematics in industry·2019· 1 cited
Bond Wire Models
Mathematics in industry·2019
Methodology and Best-Practice Guidelines for Thermally Optimized Driver Design
Mathematics in industry·2019· 1 cited
Estimating Failure Probabilities
Mathematics in industry·2019· 1 cited
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Frequent Co-authors

Yogesh Singh Chauhan(12), Adrian M. Ionescu(12), C. Anghel(12), Benoit Bakeroot(10), M. Declercq(9), N. Hefyene(9), S. Frere(8), Adrijan Barić(8), J.-P. Colinge(7), Jean‐Pierre Raskin(6), D. Vanhoenacker(6), F. Krummenacher(6), Bart Nauwelaers(5), A. M. Ionescu(5), Denis Flandre(4), C. Maier(4), Tvrtko Mandić(4), Jan Doutreloigne(4), M. Tack(4), Raul Blečić(4)