Chunyue Huang

Zhongyuan University of Technology — China

Engineering · Physical Sciences

7h-index273citations124works2.02yr avg
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Research Topics

Electronic Packaging and Soldering Technologies(72), 3D IC and TSV technologies(43), Metallurgy and Material Forming(23), Metal Forming Simulation Techniques(22), Advanced Surface Polishing Techniques(9)

Publications124 total

Torsional stress analysis and optimization of SOP solder joints using SnBiInZn high-entropy alloy solder
Microelectronics Journal·2025
Research on fluorescence enhancement and acid-induced chromic behaviors of berberine-based supramolecular self-assembled systems driven by host-guest interactions
Dyes and Pigments·2025
Analysis and prediction of bending-torsion coupled stress in BGA stacked solder joints considering interaction effects
Microelectronics Journal·2025· 3 cited
Study on the optimization of bending-vibration coupling stress of QFN solder joints based on Taguchi orthogonal experimental design and Harris Hawks Optimization algorithm
Microelectronics Reliability·2025· 3 cited
Stress–strain analysis and optimization of BGA stacked solder joints under extreme temperatures based on orthogonal design and grey relational analysis
Microelectronics Reliability·2025
Stress analysis and optimization of QFN solder joints under bending-torsion coupled conditions based on the SSA
Microelectronics Journal·2025· 6 cited
Stress–strain analysis and prediction of WLCSP solder joints under bending–torsion coupled loading
Microelectronics Reliability·2025· 3 cited
Thermal-Torsion Coupling Loading Analysis and Optimization of 3-D PoP Assembly Solder Joints at Different Temperatures
IEEE Transactions on Components Packaging and Manufacturing Technology·2025· 2 cited
Reliability analysis of PoP stacked solder joints under thermal cycling load based on the optimal equivalent model
Microelectronics Journal·2025· 5 cited
Finite-Element Analysis and Multiobjective Optimization of Solder Joint Temperature Difference and Cooling Stress During PCBA Reflow Process
IEEE Transactions on Components Packaging and Manufacturing Technology·2025· 4 cited
Analysis and Prediction of Bending-Torsion Coupled Stress in Bga Stacked Solder Joints Considering Interaction Effects
SSRN Electronic Journal·2025Open Access
Torsional Stress Analysis and Optimization of SOP Solder Joints Using SnBiInZn High-Entropy Alloy Solder
SSRN Electronic Journal·2025Open Access
Reliability Analysis of Pop Stacked Solder Joints Under Thermal Cycling Load Based on the Optimal Equivalent Model
SSRN Electronic Journal·2025Open Access
Multiobjective Optimization Study of Stacked BGA Solder Joints Under Coupled Bending-Vibration Load and Crosstalk Effects
IEEE Transactions on Components Packaging and Manufacturing Technology·2024· 2 cited
Multi-objective optimal design of thermal-vibration stress and return loss of TSV interconnect structures based on response surface-NSWOA optimization algorithm
Microelectronics Reliability·2024· 6 cited
Solder joints stress analysis and optimization of chip component under shear and tensile load based on orthogonal experimental design and gray correlation analysis
Microelectronics Reliability·2024· 2 cited
Stress analysis and signal integrity analysis of CSP solder joints under thermally torsional loading
2024
Stress Analysis and Optimization of POP Stacked Solder Joints Under Power Cyclic Loading
2024· 1 cited
Stress Analysis and Optimization of Laminated Solder Joints Under Bending and Torsion Loads
2024
Stress Analysis and Gray Relation Optimization of QFP Solder Joints Under Torsional and Bending Loading
2024· 1 cited
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Frequent Co-authors

Liang Ying(16), Huaiquan Zhang(8), Tianming Li(8), Chao Gao(8), Gui Wang(6), Shuaidong Liao(5), Xiang-qiong Tang(5), Sheng-jun Zhao(5), Liangkun Lu(5), Xianjia Liu(5), Shoufu Liu(4), Lilin Wang(4), Liye Wu(4), Wei He(3), Zhaohua Wu(3), Xiong Guoji(3), Zhiqin Cao(3), Xiaobin Liu(3), Zhou De-jian(2), Tang Wenliang(2)