F.G. Yost

Engineering · Physical Sciences

27h-index2.0kcitations98works0.02yr avg
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Research Topics

Electronic Packaging and Soldering Technologies(37), Metal and Thin Film Mechanics(20), 3D IC and TSV technologies(12), Adhesion, Friction, and Surface Interactions(11), Metal Alloys Wear and Properties(11)

Publications98 total

Coated and Alloyed Effects of Ti, Zr and Hf on Reactive Wetting of Al2O3
i-manager’s Journal on Future Engineering and Technology·2006· 1 cited
Reaction layers and mechanisms for a Ti-activated braze on sapphire
Metallurgical and Materials Transactions A·2003· 54 cited
Stress-driven diffusive voiding of aluminum conductor lines
2003· 25 citedOpen Access
Reactions and reaction layers in a Ti-activated braze on sapphire.
OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information)·2003
Direct measurement of stress-induced void growth by thermal wave modulated optical reflectance image
2002· 3 cited
Kinetics of reactive wetting
Scripta Materialia·2000· 22 cited
Stress Voiding During Wafer Processing
1999Open Access
Metastable and equilibrium wetting states in the Bi–Sn system
Acta Materialia·1998· 41 cited
Capillary Flow in Irregular Surface Grooves
Langmuir·1998· 71 cited
Energetics and kinetics of dissolutive wetting processes
Acta Materialia·1998· 49 cited
The Triple Line in Reactive Wetting
Scripta Materialia·1998· 11 cited
Model determination and validation for reactive wetting processes
1998Open Access
Solder wetting kinetics in narrow V-grooves
Acta Materialia·1997· 73 cited
Our growing understanding of nonlinear effects in materials science
JOM·1997Open Access
Areal array jetting device for ball grid arrays
University of North Texas Digital Library (University of North Texas)·1997Open Access
Description of a solder pulse generator for the single step formation of ball grid arrays
1997Open Access
Development of Alternatives to Pb-Based Solders
1997· 4 citedOpen Access
The effect of lead content and surface roughness on wetting and spreading of low-lead and no-lead solders on copper-clad FR-4 laminates
University of North Texas Digital Library (University of North Texas)·1997Open Access
Assessing the effect of surface roughness on the wetting of Cu and Pd by Sn/Pb solder
1996Open Access
Flow in an open channel capillary
Journal of Fluid Mechanics·1996· 169 cited
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Frequent Co-authors

L.E. Pope(8), J. A. Knapp(7), O. T. Inal(6), R. R. Rye(5), S. T. Picraux(5), M. M. Karnowsky(5), J. Adin Mann(4), D.M. Follstaedt(4), D. M. Follstaedt(4), A. D. Romig(4), F.M. Hosking(3), D. R. Frear(3), Eoin O’Toole(3), Louis A. Romero(2), S. T. Picraux(2), D. E. Amos(2), F. P. Ganyard(2), F.R. Michael(1), Eduard Eisenmann(1), J. R. Lloyd(1)