Stefan E. Schulz

Chemnitz University of Technology — Germany

Materials Science · Physical Sciences

23h-index2.7kcitations323works1.42yr avg
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Research Topics

Copper Interconnects and Reliability(119), Semiconductor materials and devices(110), Metal and Thin Film Mechanics(43), Carbon Nanotubes in Composites(42), Crystallization and Solubility Studies(29)

Publications322 total

Rettungsdienstbezogene Studiengänge in Deutschland
Notfall + Rettungsmedizin·2025· 1 citedOpen Access
FluidFM Deposition of Semiconductor Quantum Dots From Aqueous Dispersions
Nano Select·2025· 3 citedOpen Access
Low-temperature ALD of metallic cobalt using the CoCOhept precursor: Simulation-assisted process development for deposition on temperature sensitive 3D-structures
Journal of Vacuum Science & Technology A Vacuum Surfaces and Films·2025· 2 citedOpen Access
Unveiling Electron‐Phonon and Electron‐Magnon Interactions in the Weak Itinerant Ferromagnet LaCo<sub>2</sub>P<sub>2</sub>
Advanced Physics Research·2024· 1 citedOpen Access
Investigations on Low-Temperature Aluminium Thermocompression Bonding Using Surface Passivation Technique
2024
Low Temperature LiTaO<sub>3</sub>-to-Si Wafer Bonding
2024
Erratum: “Modeling the temporal evolution and stability of thin evaporating films for wafer surface processing” [J. Chem. Phys. 157, 084706 (2022)]
The Journal of Chemical Physics·2024
Navigating Complex Process and Design Challenges in Hybrid Bonding for Advanced Semiconductor Integration: A Comprehensive Analysis
ECS Journal of Solid State Science and Technology·2024· 2 citedOpen Access
Impact of Dielectric Types on Surface Topography for Wafer-Level Hybrid Bonding
2024· 1 cited
Fine Pitch Aluminum Hybrid Bonding: Overcoming the Challenges in Plating, Passivation and Bonding
2024· 1 cited
Molecular approach to semiconductors: a shift towards ecofriendly manufacturing and neuroinspired interfaces
Pure and Applied Chemistry·2024· 4 cited
Death Can Be Clarifying: Considering the Forces That Move Us
Policy Press eBooks·2024
Process Development of Aluminum Electroplating from an Ionic Liquid on 150 mm Wafer Level
Micromachines·2024· 6 citedOpen Access
Investigations on low-temperature thermocompression bonding of passivated aluminum for enhanced wafer-level packaging and heterogeneous integration
2024
A comparison of current alcohol hangover treatments in Australia and the UK: Ingredients, serving modes, and effectiveness
Neuroscience Applied·2024Open Access
Process and Design Challenges for Hybrid Bonding
ECS Meeting Abstracts·2023
(Invited) Integration of Functional Nanostructures and Nanoparticles into Micro- and Nanoelectronic Components and Systems
ECS Meeting Abstracts·2023· 1 cited
Advancing Fine Pitch (&lt; 5μm) Interconnects through Self-Aligned Die-to-Wafer Hybrid Bonding for Chiplet Integration
2023
Process and Design Challenges for Hybrid Bonding
ECS Transactions·2023· 16 citedOpen Access
Low temperature atomic layer deposition of cobalt using dicobalt hexacarbonyl-1-heptyne as precursor
Beilstein Journal of Nanotechnology·2023· 4 citedOpen Access
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Frequent Co-authors

Thomas Geßner(28), Heinrich Lang(17), Sascha Hermann(9), Dietrich R. T. Zahn(8), Tobias Rüffer(8), Thomas Waechtler(7), Alexander Jakob(7), Ramona Ecke(6), Jörg Schuster(5), Thomas Blaudeck(5), Michael Hietschold(4), Robert Mothes(4), S. Frühauf(4), Colin Georgi(4), Steffen Oswald(3), Nina Roth(3), Christopher P. Murray(3), I. Streiter(3), Raúl D. Rodriguez(3), M. Rennau(3)