Brian M. Foley

Applied Thermal Sciences (United States) — United States

Materials Science · Physical Sciences

28h-index4.8kcitations110works0.02yr avg
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Research Topics

Thermal properties of materials(43), Ferroelectric and Piezoelectric Materials(17), GaN-based semiconductor devices and materials(14), Advanced Thermoelectric Materials and Devices(14), Graphene research and applications(9)

Publications110 total

Characterization of Quantum Cascade Laser Facets via Steady-State Thermoreflectance
2024
A novel approach to measuring local mechanical properties via photothermal excitation of an atomic force microscope probe using an optical pump–probe inspired design
AIP Advances·2023· 2 citedOpen Access
Sodium molybdate‐hexagonal boron nitride composites enabled by cold sintering for microwave dielectric substrates
Journal of the American Ceramic Society·2023· 11 citedOpen Access
Time domain thermoreflectance measurements and phonon gas modeling of the thermal conductivity of silicon doped indium phosphide pertinent to quantum cascade lasers
APL Materials·2023· 1 citedOpen Access
Thermal rectification in thin film metalattice structures: A computational study
Journal of Applied Physics·2023· 1 cited
Dielectric characterization of paraelectric particle-loaded polymer matrix composites and commercial photoresins at W-band frequencies
Heliyon·2023· 9 citedOpen Access
Broadband Characterization of Silicate Materials for Potential 5G/6G Applications
IEEE Transactions on Instrumentation and Measurement·2023· 18 cited
Incoherent-to-coherent crossover in thermal transport through III–V alloy superlattices
Applied Physics Letters·2022· 10 cited
Growth-microstructure-thermal property relations in AlN thin films
Journal of Applied Physics·2022· 15 cited
Gate resistance thermometry: An electrical thermal characterization technique
Elsevier eBooks·2022· 6 cited
Contributors
Elsevier eBooks·2022
Thermal Transport Across Al-(AlxGa1-x)2O3 and Al-Ga2O3 Interfaces
2021
Ga<sub>2</sub>O<sub>3</sub>-on-SiC Composite Wafer for Thermal Management of Ultrawide Bandgap Electronics
ACS Applied Materials & Interfaces·2021· 95 cited
Thermal Conductivity of β-Phase Ga<sub>2</sub>O<sub>3</sub> and (Al<i><sub><b>x</b></sub></i>Ga<sub>1–</sub><i><sub><b>x</b></sub></i>)<sub>2</sub>O<sub>3</sub> Heteroepitaxial Thin Films
ACS Applied Materials & Interfaces·2021· 60 citedOpen Access
Application of 3-omega method for thin-film heat flux gauge calibration
Measurement Science and Technology·2021· 3 cited
Diamond-Incorporated Flip-Chip Integration for Thermal Management of GaN and Ultra-Wide Bandgap RF Power Amplifiers
IEEE Transactions on Components Packaging and Manufacturing Technology·2021· 55 cited
Thermal Conductivity of Aluminum Scandium Nitride for 5G Mobile Applications and Beyond
ACS Applied Materials & Interfaces·2021· 97 citedOpen Access
Steady-state methods for measuring in-plane thermal conductivity of thin films for heat spreading applications
Review of Scientific Instruments·2021· 8 cited
Broadband Dielectric Characterization from 10 mHz to 100 GHz of a 3D Printable Material
ACS symposium series·2021· 6 cited
Characterization of the Thermal Boundary Resistance of a Ga<sub>2</sub>O<sub>3</sub>/4H-SiC Composite Wafer
2020· 3 cited
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Frequent Co-authors

Patrick E. Hopkins(24), Yiwen Song(9), Sukwon Choi(9), John T. Gaskins(8), Ramez Cheaito(7), John C. Duda(7), Jon‐Paul Maria(7), Jon F. Ihlefeld(6), Ashutosh Giri(6), Carlos Perez(5), James Spencer Lundh(5), Samuel Graham(5), R. Czerw(4), Humberto Terrones(4), P. M. Ajayan(4), Bryan Kaehr(4), Susan Trolier‐McKinstry(4), Thomas E. Beechem(4), Kevin Ferri(4), David W. Snyder(4)