Yasuo Takahashi

Showa Corporation — Japan

Engineering · Physical Sciences

19h-index1.5kcitations218works0.02yr avg
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Research Topics

Electronic Packaging and Soldering Technologies(45), Semiconductor materials and devices(38), Physics of Superconductivity and Magnetism(36), 3D IC and TSV technologies(19), Adhesion, Friction, and Surface Interactions(19)

Publications218 total

Development of Ba–Zr–O-Doped Y–Gd–Ba–Cu–O Coated Conductors Using a Reel-to-Reel System Furnace
IEEE Transactions on Applied Superconductivity·2023· 2 cited
Development of Superconducting Cable and Coated Conductors for Electric Propulsion System of Airplane
IEEE Transactions on Applied Superconductivity·2023· 11 cited
Mechanisms of Analog Memristor Operations of Amorphous TaO x Probed on the Atomically Flat Surfaces
The Japan Society of Applied Physics·2021
Effect of SiC crystal orientation on Ti3SiC2formation between SiC and Al/Ti bi-layered film
Ceramics International·2020
Numerical Analysis of Vibrating Intrinsic Reverberation Chamber between Various Shielding Effectiveness Measurement Techniques
2020· 3 citedOpen Access
Non-uniform gate-capacitance distribution in the multi-dot single-electron devices due to three-dimensional structure of dots
2020
Noncontact detection of concrete flaws by neural network classification of laser doppler vibrometer signals
Engineering Research Express·2020· 7 cited
[The 11th Silicon Technology Division Award Speech] Electron Aspirator using Electron-Electron Scattering in Nanoscale Silicon
The Japan Society of Applied Physics·2020
Si electron nano-aspirator en-route for energy-efficient hydro-electronic devices
The Japan Society of Applied Physics·2019
Validation of Vibrating Intrinsic Reverberation Chamber using Computational Electromagnetics
2019· 11 cited
Evaluation of switching characteristics of Ta2O5-δ based analog resistive memory using Cu and Ta top electrode
IEICE Technical Report; IEICE Tech. Rep.·2019
In-Situ Observation of Adhesion Behavior During Ultrasonic Al Ribbon Bonding
Applied Sciences·2019· 9 citedOpen Access
Dispersion-Free and Tunable Nonreciprocities in Composite Right-/Left-Handed Metamaterials and Their Applications to Beam Squint Reduction in Leaky-Wave Antennas
IEEE Transactions on Microwave Theory and Techniques·2019· 21 cited
Beam Squint Reduction in Pseudo-Traveling Wave Resonant Antenna Based on Nonreciprocal Metamaterials
IEICE Technical Report; IEICE Tech. Rep.·2019
Investigation of Tunneling Thickness of Fe-MgF2 Glanular Film for Single Electron Transistor Operation
Proceedings of the Korean Institute of Information and Commucation Sciences Conference·2019
Statistical Analysis for Reverberation Chamber with Flexible Shaking Walls with Various Amplitudes
2018· 13 cited
Ternary Ti–Si–C alloy film formation on GaN and contact properties
Ceramics International·2018· 2 cited
Development of surface planarization process using MOD-Gd-Zr-O layer
Journal of Physics Conference Series·2018· 3 citedOpen Access
FePt-C膜におけるレーザ誘起磁化動力学のマイクロ磁気的研究【JST・京大機械翻訳】
IEEE Conference Proceedings·2018
Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding
Journal of Electronic Packaging·2017· 13 cited
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Frequent Co-authors

Masakatsu Maeda(8), Ken’ichi Nishiguchi(7), I. Hirabayashi(5), K. Inoue(4), Teruo Izumi(4), Takeshi Araki(4), Y. Iijima(4), Takeshi Hasegawa(4), Yuh Shiohara(4), T. Yamane(4), Kazuyuki Takeda(3), Yutaka Yamada(3), Makoto Hara(3), Yuji Aoki(3), Toru Otsuru(2), Reiji Tomiku(2), Hideo Namatsu(2), Akihisa Inoue(2), M. Iwakuma(2), K. Tanabe(2)