Jin-Hyung Park

Yong In University — South Korea

Engineering · Physical Sciences

16h-index1.0kcitations127works0.12yr avg
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Research Topics

Advanced Surface Polishing Techniques(41), Diamond and Carbon-based Materials Research(15), Advanced machining processes and optimization(12), Semiconductor materials and devices(7), Laser Material Processing Techniques(6)

Publications127 total

Enhancing Adhesive Strength between Metal and Plastic in Smartphone Applications
Journal of the Korean Society of Manufacturing Process Engineers·2025
Effects of Hydrolysis Reaction and Abrasive Drag Force Accelerator on Enhancing Si-Wafer Polishing Rate and Improving Si-Wafer Surface Roughness
Nanomaterials·2025Open Access
Impact of Tumor Location on Aesthetic Outcomes in Oncoplastic Breast-Conserving Surgery: A Retrospective Comparison of Three Acellular Dermal Matrix Techniques
Cancers·2025· 1 citedOpen Access
Designing a Multi-Filtering Architecture for Blocking Government-Funded Research Institute E-mail Attacks
Asia-pacific Journal of Convergent Research Interchange·2025Open Access
Sulfate Radical Oxidation for Enhancing Polishing-Rate Forhardmask-Film Chemical–Mechanical-Planarization
ECS Meeting Abstracts·2024
Diameter and Morphology of Colloidal-Silica-Abrasives Depending on Surfactant Concentration with Amine-Functional Group
ECS Meeting Abstracts·2024
(Invited) Achieving Erosion Less Designing Cu- and Isolation-Film Polishing-Rate Selectivity in Cu-Film Chemical Mechanical Planarization
ECS Meeting Abstracts·2024
(Dielectric Science and Technology Division Poster Award, 3rd Place) Radical Oxidation for Enhancing Polishing-Rate and Improving Slurry Stability in Ag-Film Chemical–Mechanical-Planarization
ECS Meeting Abstracts·2024
A Study on the Prevention of Internal Information Leakage Using RPA
Asia-pacific Journal of Convergent Research Interchange·2024Open Access
Effect of Ferric Catalyst on Chemical Decomposition of Polyimide-Film-Surface for Enhancing Chemical–Mechanical-Planarization Polishing-Rate
ECS Meeting Abstracts·2023
Controlling Diameter and Morphology of Colloidal-Silica-Abrasives Via Designing Surfactant Functional Group
ECS Meeting Abstracts·2023
Suggestions on the Cyber Resilience Application of Government-funded Institute
Asia-pacific Journal of Convergent Research Interchange·2023Open Access
Silicon Wafer CMP Slurry Using a Hydrolysis Reaction Accelerator with an Amine Functional Group Remarkably Enhances Polishing Rate
Nanomaterials·2022· 25 citedOpen Access
Changing Susceptibility of Staphylococci in Patients with Implant-Based Breast Reconstructions: A Single-Center Experience
Medicina·2022· 1 citedOpen Access
Review of 107 Oncoplastic Surgeries Using an Acellular Dermal Matrix with the Round Block Technique
Journal of Clinical Medicine·2022· 3 citedOpen Access
Surface Transformation of Spin-on-Carbon Film via Forming Carbon Iron Complex for Remarkably Enhanced Polishing Rate
Nanomaterials·2022· 5 citedOpen Access
Polymer link breakage of polyimide-film-surface using hydrolysis reaction accelerator for enhancing chemical–mechanical-planarization polishing-rate
Scientific Reports·2022· 5 citedOpen Access
Evaluation of Radiation Resistance of Polystyrene Using Molecular Dynamics Simulation
Materials·2022· 7 citedOpen Access
Scavenger with Protonated Phosphite Ions for Incredible Nanoscale ZrO2-Abrasive Dispersant Stability Enhancement and Related Tungsten-Film Surface Chemical–Mechanical Planarization
Nanomaterials·2021· 5 citedOpen Access
Fenton Reaction for Enhancing Polishing Rate and Protonated Amine Functional Group Polymer for Inhibiting Corrosion in Ge1Sb4Te5 Film Surface Chemical-Mechanical-Planarization
Applied Sciences·2021· 6 citedOpen Access
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Frequent Co-authors

Jea‐Gun Park(22), Hao Cui(8), Inyeal Lee(5), Gil‐Ho Kim(5), Hee-Sub Hwang(5), Servin Rathi(4), Chang‐Sung Jeong(4), Jong-Young Cho(4), Jae‐Young Bae(4), Sok-Ho Yi(3), Man-Hyup Han(3), Pilsu Kim(3), Jong‐Chan Lee(3), Gi-Ppeum Jeong(3), Dongkon Lee(2), Hongtae Kim(2), Jeong Min Baik(2), Seung‐Jae Lee(2), Eun‐Seong Kim(2), Jae-Hyung Lim(2)