Morihiko Ikemizu

Advanced Institute of Industrial Technology — Japan

Engineering · Physical Sciences

4h-index57citations20works0.02yr avg
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Research Topics

3D IC and TSV technologies(5), Job Satisfaction and Organizational Behavior(4), Electronic Packaging and Soldering Technologies(4), Collaboration in agile enterprises(3), Labor Movements and Unions(2)

Publications20 total

Observing the Relationships of Factors Between Before Enrollment and After Graduation from a Questionnaire Aimed at General Adult Learners
Studies in computational intelligence·2026
Effects of Career Change Opportunities for Graduates After Graduation from an Educational Institute
IIAI Letters on Institutional Research·2026Open Access
Correlation between Learning Motivation and Realization among Working Students, and the Factors
IIAI Letters on Business and Decision Science·2025Open Access
Some Antecedents of Employee Engagement of Japanese Companies
Information Engineering Express·2024Open Access
A Study of the Effect of Age on Employee Engagement
IIAI Letters on Business and Decision Science·2024Open Access
Research on the Relationship Between Internal Company Events and Work Performance
IIAI Letters on Informatics and Interdisciplinary Research·2023Open Access
Developing Hypotheses and Theoretical Verification of Antecedents of Organization Engagement that Contribute to Clarification of Employee Engagement
IIAI Letters on Business and Decision Science·2023Open Access
New Conceptual Model of Employee Engagement in Formal and Informal Organizations of Japanese Companies
International Journal of Service and Knowledge Management·2023· 2 citedOpen Access
Issues in Introduction of Concept of Employee Engagement in Japanese Companies
EPiC series in computing·2022Open Access
Factors Affecting Employee Engagement Based on an Employee Attitude Survey in Japan
IIAI Letters on Business and Decision Science·2022Open Access
Small, lightweight and thin package (TQON)
2003· 9 cited
Evaluation of solder joint reliability between PWB and CSP by using high TCE ceramic material
2002· 4 cited
CSP solder ball reliability
2002· 5 cited
Development of Ultra Thin Package
1998· 1 cited
Trend of BGACSPKGD. Developing Trend of High Pin Count BGA.
Journal of The Japan Institute of Electronics Packaging·1998· 1 citedOpen Access
TAB Technology Applied Semiconductor Packages.
Journal of SHM·1996Open Access
Electrochemical Migration in Three Layer TAB Tape with Tin-plated Lead
Technical report of IEICE. ICD·1995· 1 cited
Cavitation history effect of a water-metal Berthelot tube system interpreted by an elaborated gas-trapping crevice model
Journal of Physics D Applied Physics·1989· 12 cited
Degassing pretreatment approach for the sealing metal of a metal Berthelot tube
Journal of Physics D Applied Physics·1989· 4 cited
The two-stage increase in negative pressure with repeated cavitation for water in a metal Berthelot tube
Journal of Physics D Applied Physics·1988· 18 cited

Frequent Co-authors

Takaaki Hosoda(10), Tokuro Matsuo(9), Hiroyuki Maruyama(4), Teruhisa Hochin(4), Yoshihito Ohde(3), Hisashi Okamoto(3), Jiro Nakano(3), Yuya Yokoyama(3), Toshiaki Yokoi(2), H. Funakura(2), E. Hosomi(2), W Hosokawa(1), Tsuneyo Ando(1), T. Yokoyama(1), Shinji SHIBATA(1), Mitsuru Ooida(1), Yasuhiro Koshio(1), Y. Fukuzawa(1), K. Miyajima(1), H. Yonekura(1)