Craig Armiento

RTX (United States) — United States

Physics and Astronomy · Physical Sciences

18h-index1.2kcitations103works0.02yr avg
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Research Topics

Semiconductor Quantum Structures and Devices(39), Semiconductor Lasers and Optical Devices(35), Photonic and Optical Devices(22), Advanced Semiconductor Detectors and Materials(15), 3D IC and TSV technologies(10)

Publications103 total

Carbon Queen: The Remarkable Life of Nanoscience Pioneer Mildred Dresselhaus—Mia Weinstock (Cambridge, MA, USA: MIT Press, 2023, 320 pp.)
IEEE Technology and Society Magazine·2023Open Access
High Speed Digital Signaling in Printed, Planar Microwave Connectors with Multiple Signal Lines
2023
A New Method for Improving Return Loss in Additively Integrated Bare Die Amplifiers
2023· 1 cited
Additive Packaging for Bare Die and Additively Integrated Antenna
IMAPSource Proceedings·2023Open Access
Printed, Planar Microwave Connector with Multiple Signal Lines
2023Open Access
Stabilizing Selective Laser-Sintered Silver–Barium Strontium Titanate (Ag-BST) Resistors Using a UV-Curable Ink
Journal of Electronic Materials·2022· 1 cited
Comparison of Additive Manufacturing Methods for the Attachment of Bare Die to Printed Circuit Boards
2022 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (AP-S/URSI)·2022· 5 cited
Printed Microwave Connector
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)·2022Open Access
Author Index
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)·2022Open Access
Overcoming Variability in Printed RF: A Statistical Method to Designing for Unpredictable Dimensionality
Designs·2022· 1 citedOpen Access
Formulation and Characterization of Sinterless Barium Strontium Titanate (BST) Dielectric Nanoparticle Ink for Printed RF and Microwave Applications
Journal of Electronic Materials·2021· 7 citedOpen Access
Selective laser sintering of conductive patterns on a novel silver–barium strontium titanate composite material
Flexible and Printed Electronics·2020· 2 cited
Photonic Curing of Copper Ink Films on Liquid Crystal Polymer Substrate
MRS Advances·2020· 2 cited
Assistive Technology (AT): Opportunities for Interdisciplinary Research, Education, and Service Delivery
2020Open Access
Multi-material Printed Microwave Element for Phased Array Applications
2019
Formulation and characterization of sinterless Barium Strontium Titanate (BST) nanocomposite dielectric inks for flexible RF and Microwave electronics applications
Bulletin of the American Physical Society·2019· 1 cited
Additive Packaging for Microwave Applications
IMAPSource Proceedings·2017· 1 cited
All-printed conformai electronically scanned phased array
2017· 1 cited
Broadband microwave dielectric characterization method for printable dielectric inks
2017· 1 cited
Printed electronics and additive packaging for microwave applications
2017· 4 cited
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Frequent Co-authors

Alkim Akyurtlu(12), Paul O. Haugsjaa(10), Mahdi Haghzadeh(9), M. Tabasky(8), M. Rothman(8), A. Negri(8), Emil S. Köteles(6), S. H. Groves(6), B. Elman(6), P. Melman(6), T. W. Fitzgerald(5), C.L. Shieh(5), J.P. Donnelly(5), C. Jagannath(4), Anwesha Choudhury(4), V. Barry(3), R. Boudreau(3), C. E. Hurwitz(3), V. Diadiuk(3), Lal Mohan Bhowmik(3)