Chad C. Terwilliger

Corning (United States) — United States

Engineering · Physical Sciences

7h-index160citations23works3.42yr avg
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Research Topics

Semiconductor Lasers and Optical Devices(21), Photonic and Optical Devices(19), Advanced Photonic Communication Systems(5), Optical Network Technologies(4), Laser Material Processing Techniques(3)

Publications23 total

Integrated, Heat Resistant, Glass Waveguides with 0.01 \text{dB}/\text{cm}$ Bend Loss for $50-\mu \mathrm{m}$ Pitch Conversion in High-Density Optical Interconnects
2025
Large-Scale Glass Waveguide Circuit for Board-Level Optical Interconnects Between Faceplate and Co-Packaged Optical Transceivers
2025· 3 cited
Glass substrate with integrated adiabatic waveguide bends for high-density fiber-to-chip coupling
2025· 1 cited
Wafer-scale fabrication of opto-electronic glass substrates for co-packaged optics (Conference Presentation)
2025
High-density Evanescent Chip Coupling with Detachable Fiber Connector for Co-packaged Optics
2025· 2 cited
Integrated Glass Waveguide Circuit for Co-packaged Optics in Radio-Access Networks
2025· 3 cited
Ultra Low-Loss Ion-Exchange Waveguides in Optimized Alkali Glass for Co-Packaged Optics
2024· 17 cited
Photonic glass interposer with integrated optical waveguides for fiber-to-chip coupling
2024· 1 cited
Ultrafast laser processing of glass waveguide substrates for multi-fiber connectivity in co-packaged optics
Advanced Optical Technologies·2023· 17 citedOpen Access
Glass Substrate for Co-Packaged Optics
IMAPSource Proceedings·2023· 7 citedOpen Access
Towards high-volume manufacturing of optoelectronic glass substrates for co-packaged optics
2023· 1 cited
Slim Push-Pull Fiber Array Connector for Optical Chips
2023
Slim Push-Pull Fiber Array Connector for Optical Chips
2023· 3 cited
Glass Platform for Co-Packaged Optics
IEEE Journal of Selected Topics in Quantum Electronics·2023· 34 cited
Ultrafast laser singulation of optical circuits with optical quality end-facets
2022· 6 cited
Glass Interposer for High-Density Photonic Packaging
Optical Fiber Communication Conference (OFC) 2022·2022· 13 cited
Passive Aligned Glass Waveguide Connector for Co-Packaged Optics
2021· 10 cited
Thermally stable single-mode glass waveguides with fiber connectors for co-packaged optics
2021
Non-diffractive Beam Cleaving of Fibers for Optical Connectivity
Frontiers in Optics + Laser Science 2021·2021
Glass Substrate With Integrated Waveguides for Surface Mount Photonic Packaging
Journal of Lightwave Technology·2020· 36 cited
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Frequent Co-authors

Lars Brusberg(22), Jason R. Grenier(18), Betsy J. Johnson(9), Aramais R. Zakharian(8), Lucas W. Yeary(8), Jeffrey S. Clark(8), Katerina Rousseva(6), Matthew J. Dejneka(5), Robert A. Bellman(4), Daniel W. Levesque(4), Robin M. Force(4), Şükrü Ekin Kocabaş(3), Barry Paddock(3), K. A. Wieland(3), Seong-Ho Seok(2), JungHyun Noh(2), Jurgen Matthies(2), Clifford G. Sutton(2), Juergen Matthies(2), Beibei Zeng(2)