Tae‐Ik Lee

Korea Institute of Industrial Technology — South Korea

Engineering · Physical Sciences

19h-index1.7kcitations58works2.62yr avg
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Research Topics

Electronic Packaging and Soldering Technologies(24), Advanced Sensor and Energy Harvesting Materials(22), 3D IC and TSV technologies(16), Conducting polymers and applications(6), Nanomaterials and Printing Technologies(6)

Publications58 total

A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, material property determination, and structural considerations
Materials Science in Semiconductor Processing·2025· 1 cited
Absorber-Free Laser Welding of Transparent Thermoplastic Films via Expanded Beam for Flexible Displays
ACS Applied Materials & Interfaces·2025
Deformation-informed design of dual-cure adhesives for camera modules via microscale digital image correlation
Materials & Design·2025Open Access
Oxidation-Inhibited Cu Direct Bonding via Glucose Vapor for Green Semiconductor Packaging
2025
Non-destructive interconnection reliability validation by warpage for ball grid array packages using digital image correlation
2025
Laser-Assisted Bonding of Flexible Polymer Substrates and Electrodes Using Carbon Nanotubes
ACS Applied Polymer Materials·2025· 2 cited
Direct Tensile Testing of Free‐Standing Ultrathin Polymer Films on Liquid Surface at High Temperature
Small Methods·2024· 5 citedOpen Access
Glycerol Vapor Assisted Cu Direct Bonding: Implications for 3D Semiconductor Packaging
Advanced Materials Technologies·2024· 5 citedOpen Access
Microwave Bonding of Thin Polymer Substrates Using Carbon Nanotubes for Flexible Interconnections
ACS Applied Nano Materials·2024· 6 cited
Evaluating Free Thermal Expansion and Glass Transition of Ultrathin Polymer Films on Heated Liquid
ACS Applied Materials & Interfaces·2024· 7 cited
Fast, facile and thermal damage free nanowelding of Ag nanowire for flexible transparent conductive film by pressure-assisted microwave irradiation
Scientific Reports·2023· 6 citedOpen Access
Power cycling tests under driving ΔTj = 125 °C on the Cu clip bonded EV power module
Microelectronics Reliability·2022· 22 cited
Joint reliability of Al wire bonding on OSP and ENIG surface-finished substrates under complex stress induced with current and temperature
Journal of Materials Science Materials in Electronics·2022· 3 cited
Siloxane Hybrid Material-Encapsulated Highly Robust Flexible μLEDs for Biocompatible Lighting Applications
ACS Applied Materials & Interfaces·2022· 18 cited
Enlarged tensile strain at edge of flexible substrate due to anticlastic curvature
Microelectronics Reliability·2022· 4 cited
Ultrathin, Flexible, and Transparent Oxide Thin‐Film Transistors by Delamination and Transfer Methods for Deformable Displays
Advanced Materials Technologies·2021· 9 cited
Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding
Materials·2021· 17 citedOpen Access
Creation of Curved Nanostructures Using Soft-Materials-Derived Lithography
Nanomaterials·2020· 3 citedOpen Access
Directly Visualized Mechanical Strain Distribution in Package Interconnect Using Digital Image Correlation
ECS Meeting Abstracts·2020
Improved sinterability of micro-scale copper paste with a reducing agent
Materials Letters·2020· 22 cited
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Frequent Co-authors

Taek‐Soo Kim(37), Cheolgyu Kim(10), Kyung‐Wook Paik(10), Min Sung Kim(8), Jihye Kim(6), Donguk Kwon(4), Inkyu Park(4), Min Seong Kim(3), Keon Jae Lee(3), Jae‐Bum Pyo(3), Jeehoo Na(3), Eun Hye Lee(3), Seunghwa Ryu(2), Seung‐Hwan Kim(2), Morteza Amjadi(2), Yongrok Jeong(2), Kyuyoung Kim(2), Yong Suk Oh(2), Han Eol Lee(2), Daewon Lee(2)