Mayur K. Patel

Engineering · Physical Sciences

21h-index1.2kcitations136works0.02yr avg
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Research Topics

Fire dynamics and safety research(33), Granular flow and fluidized beds(21), Wind and Air Flow Studies(17), Evacuation and Crowd Dynamics(14), Mineral Processing and Grinding(14)

Publications136 total

Modified resin from recycled PET: structural analysis and performance in glass fiber reinforced composite with adhesive study
Composite Interfaces·2026
Comprehensive Analysis of Robotic Process Automation for Software Project Management
2025
The effect of impurities and radiation damage on the glass network—caesium loaded iron phosphate molecular dynamics case study
Journal of Physics Condensed Matter·2025
Machining through electric discharge machining (EDM) process: A mini review
AIP conference proceedings·2025
A Comprehensive Study on Fractional Calculus and Its Applications
SSRN Electronic Journal·2025Open Access
Assessment of Sustainable Manufacturing Enablers: Pythagorean Fuzzy AHP Approach
International Journal of Mechanical Engineering·2024Open Access
Development and Implementation of Wire Arc Additive Manufacturing (WAAM) Based on Pulse Spray GMAW for Aluminum Alloy (AlSi7Mg)
Transactions of the Indian Institute of Metals·2021· 15 cited
Comparative Reliability of Inkjet-Printed Electronics Packaging
IEEE Transactions on Components Packaging and Manufacturing Technology·2021· 18 cited
The Numerical Simulation of Fire Spread Within a Compartment Using an Integrated Gas and Solid Phase Combustion Model
2019· 1 cited
Fabrication of hollow polymer microstructures using dielectric and capillary forces
Microsystem Technologies·2019Open Access
SMARTFIRE v4.4: technical reference manual
2017· 1 cited
Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation
Circuit World·2016· 7 cited
Computational electrohydrodynamics in the fabrication of hollow polymer microstructures
2015· 1 cited
Digital Modelling in the Performance Evaluation of 19th Century Clipper Ships: The Thermopylae and the Cutty Sark
2014· 1 cited
Computational modeling of electrodepostion in small features under megasonic agitation
European Microelectronics and Packaging Conference·2013
Micro-scale Modelling Challenges in Electric Field Assisted Capillarity
2013
Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming
Advances in Manufacturing·2013· 14 citedOpen Access
A Hybrid Approach for the Modelling of Complex Systems: Methodologies and Applications
Journal of Algorithms & Computational Technology·2013· 2 citedOpen Access
Numerical modeling of the electroplating process for microvia fabrication
2013· 5 cited
Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation
Microsystem Technologies·2013· 22 cited
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Frequent Co-authors

Edwin R. Galea(15), C. Bailey(11), Marc P. Y. Desmulliez(9), Nicholas Christakis(9), M. Cross(8), F. Jia(8), M.S.A. Bradley(6), Mark Cross(6), H. Abou-Chakra(6), U. Tüzün(6), J. Ewer(5), Pierre Chapelle(5), John Baxter(5), N.C. Markatos(4), Tong Deng(4), K. Pericleous(4), N. Strusevich(4), David Flynn(4), Xiangdong Xue(3), Junye Wang(3)