M. S. Rosman

Universiti Teknologi MARA — Malaysia

Engineering · Physical Sciences

3h-index22citations7works0.02yr avg
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Research Topics

Silicon Carbide Semiconductor Technologies(4), Advancements in Semiconductor Devices and Circuit Design(2), Machine Fault Diagnosis Techniques(1), Analog and Mixed-Signal Circuit Design(1), Electronic Packaging and Soldering Technologies(1)

Publications7 total

Comparison of different control strategies of power cycle test for power devices
AIP conference proceedings·2021
Characterization of voids in thermal joint of semiconductor package using scanning acoustic microscope
AIP conference proceedings·2021
An Overview to Chip-based Power Transistor and Prognostics Techniques
Journal of Electrical & Electronic Systems Research·2020Open Access
An overview to chip-based power transistor and prognostics techniques / Muhamad Hazwan Abdul Halim … [et al.]
2020
An Overview of Data-Driven and Model-Driven Based Prognostics Techniques for Power Modules
2018· 9 cited
The Effect of Void in Thermal Layer on MOSFET’s Heat Dissipation
Advanced Science Letters·2017· 5 cited
Concrete Waste as a Cement Replacement Material in Concrete Blocks for Optimization of Thermal and Mechanical Properties
SHS Web of Conferences·2014· 8 citedOpen Access

Frequent Co-authors

M. H. Abdul Halim(6), Norlida Buniyamin(6), Nobuyuki Naoe(4), Akio Imazawa(2), Noor Faisal Abas(1), Md Azree Othuman Mydin(1), Kasumawati Lias(1)