Shih‐kang Lin

National Cheng Kung University — Taiwan

Engineering · Physical Sciences

29h-index2.8kcitations179works1.92yr avg
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Research Topics

Electronic Packaging and Soldering Technologies(65), 3D IC and TSV technologies(40), Advancements in Battery Materials(39), Advanced Battery Materials and Technologies(29), Intermetallics and Advanced Alloy Properties(27)

Publications178 total

Scalable cesium/potassium incorporation via CuGa:CsF/KF precursors enables high-efficiency selenized CIGSe solar cells
Solar Energy Materials and Solar Cells·2026Open Access
Mechanistic insights into the impact of sinter ore basicity on softening and melting behavior
Journal of the Taiwan Institute of Chemical Engineers·2025
Investigating Copper oxide stability in TCB Cu-Cu bonding
2025
In-Situ Compression of Single-Crystal Copper Micropillars under Electric Current Stressing
2025
The interfacial properties of Indium thermal interface materials
2025
CaCl2-assisted roasting for high-efficiency lithium extraction and fluorine stabilization in LFP battery recycling
Chemical Engineering Journal·2025
Sonochemical Synthesis of Submicrometer Ga-Based Particles for Cu-to-Cu Interconnection
ACS Applied Electronic Materials·2025Open Access
Modified galvanic replacement using ethanol vapor-assisted vacuum ultraviolet (E-VUV) for enhanced Ag deposition
Materials Letters·2025Open Access
Critical lattice strain for electromigration - revisiting the Blech critical product
Materials Characterization·2025
Enhancing three-way reforming in a blast furnace: insights into the effects of hexagonal boron nitride addition on Ni-Cu-based catalysts with different supports and their reaction mechanisms
Research on Chemical Intermediates·2025· 1 cited
Anti-Oxidation for Copper By Galvanic Replacement
2025
Surface Modification of Cu Native Oxide: Ag Displacement for Homogeneous Layering
2025· 1 cited
A Fundamental Study on Interfacial Properties of Indium Thermal Interface Materials
2025
Intermetallic Compound Formation and Growth Behavior Between Ruthenium and Tin System
2025
Phase Transitions of the CU<sub>6</sub>Sn<sub>5</sub> Phase Under Electric Currents
2025· 2 cited
Texturing and interfacial engineering strategies for regulating Zn deposition by in-situ grown ZnTe on Zn anode toward long lifespan Aquous zinc ion batteries
Journal of Power Sources·2025· 2 cited
Electroplasticity of Metals and Ceramics: Current Status
Annual Review of Materials Research·2025· 11 citedOpen Access
Revisiting the softening and melting behavior of sinter under simulated blast furnace conditions: Part II – Characteristics of microstructure evolution and grain coarsening
Journal of the Taiwan Institute of Chemical Engineers·2025· 3 cited
Revisiting the softening and melting behavior of sinter under simulated blast furnace conditions: Part I – Thermodynamic and experimental insights on working line
Journal of the Taiwan Institute of Chemical Engineers·2025· 2 cited
Phenomenological understanding of the contribution of bulk and grain boundary precipitates on strengthening in prolonged-aged Al-Zn-Mg-Cu aluminium alloys
Materials Today Advances·2025· 2 citedOpen Access
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Frequent Co-authors

Sinn-wen Chen(13), Yuchen Liu(7), Hiroshi Nishikawa(6), Chih-han Yang(5), Che‐an Lin(5), Ralph Nicolai Nasara(5), Shiqi Zhou(4), Martin Ihrig(3), Martin Finsterbusch(3), Alexander M. Laptev(3), Ruijie Ye(3), Dina Fattakhova‐Rohlfing(3), Olivier Guillon(3), Katsuaki Suganuma(3), Wen-Dung Hsu(3), Ngoc Thanh Thuy Tran(3), Shao-yu Yen(3), Yuchen Liu(3), Ping-chun Tsai(2), Chih‐Long Tsai(2)