Dionysios Manessis

Fraunhofer Institute for Reliability and Microintegration — Germany

Engineering · Physical Sciences

15h-index728citations107works1.02yr avg
OpenAlex↗ORCID↗Google Scholar↗Lab page↗

Accepting Students?

No reports yet. Know if this professor is taking students?

Research Topics

3D IC and TSV technologies(56), Electronic Packaging and Soldering Technologies(47), Metamaterials and Metasurfaces Applications(11), Additive Manufacturing and 3D Printing Technologies(11), Advanced Antenna and Metasurface Technologies(11)

Publications107 total

Development of a High-Density Adaptive Redistribution Technology for Embedded High I/O Components
SMTA International·2024
Development of an Adaptive Re-Distribution Patterning Process for Fan-Out Packages with Embedded High I/O Components
2024· 2 cited
Toward the Realization of a Programmable Metasurface Absorber Enabled by Custom Integrated Circuit Technology
2023Open Access
Toward the Realization of a Programmable Metasurface Absorber Enabled by Custom Integrated Circuit Technology
2023Open Access
On the Mobility Effect in UAV-Mounted Absorbing Metasurfaces: A Theoretical and Experimental Study
IEEE Access·2023· 16 citedOpen Access
Multifunctional Metasurface Architecture for Amplitude, Polarization and Wave-Front Control
Physical Review Applied·2022· 42 citedOpen Access
XR-RF Imaging Enabled by Software-Defined Metasurfaces and Machine Learning: Foundational Vision, Technologies and Challenges
IEEE Access·2022· 25 citedOpen Access
Design, Fabrication, and Characterization of a Proof-of-Concept Multi-functional Microwave Metasurface using Static Loads
2021 Fifteenth International Congress on Artificial Materials for Novel Wave Phenomena (Metamaterials)·2021
Development of innovative substrate and embedding technologies for high frequency applications
2021· 5 citedOpen Access
Manufacturing of high frequency substrates as software programmable metasurfaces on PCBs with integrated controller nodes
2020· 6 citedOpen Access
A multi-functional intelligent metasurface: Electromagnetic design accounting for fabrication aspects
arXiv (Cornell University)·2020· 6 citedOpen Access
Engineer the Channel and Adapt to it: Enabling Wireless Intra-Chip Communication
IEEE Transactions on Communications·2020· 2 citedOpen Access
Toward the Realization of a Programmable Metasurface Absorber Enabled by Custom Integrated Circuit Technology
IEEE Access·2020· 40 citedOpen Access
Embedding Technologies for the Manufacturing of Advanced Miniaturised Modules toward the Realisation of Compact and Environmentally Friendly Electronic Devices
2019· 3 cited
High Frequency Substrate Technologies for the Realisation of Software Programmable Metasurfaces on PCB Hardware Platforms with Integrated Controller Nodes
2019· 5 citedOpen Access
Embedding as a key Board-Level Technology for Modularization and Circular Design of Smart Mobile Products: Environmental Assessment
2019· 8 cited
The Software-Defined Metasurfaces Concept and Electromagnetic Aspects
arXiv (Cornell University)·2019· 4 citedOpen Access
Exploration of Intercell Wireless Millimeter-Wave Communication in the\n Landscape of Intelligent Metasurfaces
arXiv (Cornell University)·2019Open Access
Modular Power Electronic Systems, Based on Embedded Components
Harsh Environments Conference·2019
Engineer the Channel and Adapt to it: Enabling Wireless Intra-Chip\n Communication
arXiv (Cornell University)·2018· 3 citedOpen Access
page 1 of 6Next →

Frequent Co-authors

Andreas Ostmann(32), R. Aschenbrenner(16), Lars Boettcher(15), H. Reichl(14), S. Karaszkiewicz(10), K.-D. Lang(10), Alexandros Pitilakis(8), Odysseas Tsilipakos(8), Anna C. Tasolamprou(7), Christos Liaskos(7), R. Patzelt(6), Nikolaos V. Kantartzis(6), Maria Kafesaki(6), Martin Schneider‐Ramelow(6), Manuel Seckel(5), Costas M. Soukoulis(5), Sergei Tretyakov(5), Kypros M. Kossifos(5), Julius Georgiou(5), Giorgos Varnava(3)