Norman Chang

Ansys (United States) — United States

Engineering · Physical Sciences

15h-index793citations108works0.62yr avg
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Research Topics

Integrated Circuits and Semiconductor Failure Analysis(22), 3D IC and TSV technologies(20), Low-power high-performance VLSI design(19), Semiconductor materials and devices(15), Electromagnetic Compatibility and Noise Suppression(15)

Publications108 total

Multimodal Learning-Based Thermal Solver for 3DICs with Arbitrary Chip Dimensions and Power Distributions
2025
A Commercial EDA Perspective on Hardware Security, Safety, and Trust
2025
ML-EMFI: A Machine Learning-Driven Pre-Silicon Electromagnetic Fault Injection Security Evaluation for Robust IC Design
2025
A Fully Pipelined FIFO Based Polynomial Multiplication Hardware Architecture Based On Number Theoretic Transform
arXiv (Cornell University)·2025Open Access
Efficient ML-Based Transient Thermal Prediction for 3D-ICs
2025
Improving Location-Based Thermal Emission Side-Channel Analysis Using Iterative Transfer Learning
IEEE Access·2025Open Access
Improving Location-based Thermal Emission Side-Channel Analysis Using Iterative Transfer Learning
arXiv (Cornell University)·2024Open Access
A Hybrid Simulation Approach for Accurate and Fast System-Level Side-Channel Leakage Evaluation
2024
Modeling and Analysis of On-Chip Voltage Fluctuations Caused by Electromagnetic Fault Injection
2024
Innovative Thermal Solutions for 3D Heterogeneous Integration of Co-Packaged Optics
2024
Parallel Per-tile Activation with Linear Superposition of Thermal Response for Solving Arbitrary Power Pattern in 3DIC Thermal Simulation
2024· 2 cited
Parallel Per-tile Activation with Linear Superposition of Thermal Response for Solving Arbitrary Power Pattern in 3DIC Thermal Simulation
2024· 1 cited
Si-Backside Side-Channel Leakage Measurement and Simulation
2024
Thermal-Aware Test Frequency Optimization
2024
Novel Preprocessing Technique for Data Embedding in Engineering Code Generation Using Large Language Model
2024· 3 cited
Thermal Modeling and Simulation for Advanced 3DIC Systems
2024· 1 cited
Photon Emission Modeling and Machine-Learning Assisted Pre-Silicon Optical Side-Channel Simulation
2024· 1 cited
Dynamic IR-Drop Prediction of At-Speed Two-Vector Tests Using Machine Learning
2024
Solving 3D-IC Multiphysics Challenges with a Novel ML-Assisted Co-Optimization Methodology
2024
Design for Reliability (DFR) Aware EDA Solution for Product Reliability (Invited)
2024· 3 cited
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Frequent Co-authors

Stephen H. Pan(10), Jimin Wen(9), Lang Lin(8), Akhilesh Kumar(6), Karthik Srinivasan(6), Haiyang He(6), Ying–Shiun Li(6), Makoto Nagata(5), Calvin Chow(5), O.S. Nakagawa(4), Shen Lin(4), Wenbo Xia(4), Deqi Zhu(4), Soo‐Young Oh(4), Rishikesh Ranade(4), Lei He(3), David Geb(3), Jay Pathak(3), Harsh Shrivastav(3), Kazuki Monta(3)