Xiaodong Jian

Tongji University — China

Materials Science · Physical Sciences

22h-index1.3kcitations89works2.42yr avg
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Research Topics

Ferroelectric and Piezoelectric Materials(30), Multiferroics and related materials(22), Dielectric materials and actuators(15), Microwave Dielectric Ceramics Synthesis(12), 2D Materials and Applications(11)

Publications89 total

Enhanced electrocaloric effect in lead-free NBiSLKTSn doped BaTiO3 ceramics via high-entropy doping and an empirical relation between the ECE ΔS (ΔT) and Pm2/εm
Ceramics International·2025· 1 cited
High-cycle fatigue performance and life prediction of high-strength lockbolts with pre-tension
Journal of Constructional Steel Research·2025
Optimal Capacity Planning Method for Distributed Photovoltaics Considering the User Grid Connection Locations
Energies·2025Open Access
BaTiO3-Based Electrocaloric Materials—Recent Progresses and Perspective
Materials·2025· 1 citedOpen Access
Energy storage planning strategies for multi-scenario photovoltaic energy storage collaborative cluster control systems
Electrical Engineering·2025· 1 cited
Effect of Defect Type on Structural Strength and Thermal Properties of Si/Ti, Ti/Au, Ti/Au, and Au/Au Interfaces
2025
A study of hotspots of the TSV-RDL interconnect structure
2025
Performance enhancement mechanisms and optimization of multi-pass parallel flow condensers with liquid-vapor separation
Case Studies in Thermal Engineering·2025· 1 citedOpen Access
Superior thermal dissipation performance in diamond on chip structure established under minor pressure at low temperature
Surfaces and Interfaces·2025
Enhanced electrocaloric effect in NaNbO<sub>3</sub>-based lead-free ceramics via adjusting the ratio of relaxor ferroelectric phase over normal ferroelectric phase
Journal of Advanced Dielectrics·2025· 1 citedOpen Access
Investigation on the structural design and performance optimization of micro Y-type thermoelectric devices utilizing flexible electrical connections of liquid metal
Energy Conversion and Management·2025· 6 cited
The Open-Circuit Failure of TSV-RDL Characterized by S-Parameter
IEEE Transactions on Electron Devices·2025
Transmission Characteristics of Long-Chain Through Silicon Via-Redistribution Layer Interconnects
IEEE Transactions on Components Packaging and Manufacturing Technology·2024· 2 cited
Failure Mechanisms Investigation of Through Glass via (TGV) Under Thermal Annealing and Shock
2024· 4 cited
Boosted energy storage densities in lead-free Na0.5Bi0.5TiO3-based thick film ceramics via the compositional and microstructural tailoring
Chemical Engineering Journal·2024· 20 cited
Modeling and Characterization of Annealing Effect on the Cu Protrusion and Thermomechanically Behaviors of Through Glass Via
IEEE Transactions on Components Packaging and Manufacturing Technology·2024· 8 cited
High energy-storage density and giant negative electrocaloric effect in PLZS antiferroelectric thick film ceramics prepared via the tape-casting process
Journal of Alloys and Compounds·2024· 2 cited
Effect of High-Temperature Storage on Electrical Characteristics of Hydrogen-Treated AlGaN/GaN High-Electron-Mobility Transistors
Micromachines·2024Open Access
Boosted Energy Storage Densities in Lead-Free Na0.5bi0.5tio3-Based Thick Film Ceramics Via the Compositional and Microstructural Tailoring
SSRN Electronic Journal·2024Open Access
Performance Enhancement Mechanisms and Optimization of Multi-Pass Parallel Flow Condensers with Liquid-Vapor Separation
SSRN Electronic Journal·2024Open Access
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Frequent Co-authors

Sheng‐Guo Lu(18), Yingbang Yao(16), Bo Liang(16), Tao Tao(15), Shengjie Dong(9), Xiang Niu(8), Xiang Lin(8), Zhuo Mao(7), Wei Liang(6), Xiaobo Zhao(6), Ping Qian(6), Jiesen Li(6), Biao Lu(5), Xianyi Chen(5), Ping Wu(5), Xiongwei Lin(4), Hui Tang(4), Z. Q. Mao(4), Keke Song(4), Ping Wu(4)