C.M. Gourlay

Imperial College London — United Kingdom

Engineering · Physical Sciences

45h-index5.5kcitations221works6.62yr avg
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Research Topics

Aluminum Alloy Microstructure Properties(115), Electronic Packaging and Soldering Technologies(89), Aluminum Alloys Composites Properties(52), 3D IC and TSV technologies(35), Intermetallics and Advanced Alloy Properties(28)

Publications221 total

Effects of bismuth on the microstructure and crack propagation in Sn–Ag–Cu-Bi solder joints during thermal cycling
Journal of Materials Science Materials in Electronics·2025Open Access
Isotopically Selected Single Antimony Molecule Doping
arXiv (Cornell University)·2025Open Access
In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron Microscopy
Materials·2025· 1 citedOpen Access
In-situ investigation of discontinuous precipitation in Sn-Bi low temperature solders
Materialia·2025· 2 citedOpen Access
Dynamic Recrystallisation and Crack Propagation in a Sn-3Ag-0.5Cu/Cu Solder Joint
Preprints.org·2025Open Access
Eutectic orientation relationships in Sn-Bi solder
Journal of Alloys and Compounds·2025· 2 citedOpen Access
Effects of Ag and melt undercooling on the microstructure of Sn–Ag solder balls
Journal of Materials Science Materials in Electronics·2025· 1 citedOpen Access
Growth crystallography and in-situ imaging of nucleation and growth dynamics of Al8Mn5 solidifying in AZ magnesium alloys
Acta Materialia·2025· 5 cited
Time-Lapse Imaging of Bismuth Precipitation and Coarsening on the Surface of Sn-Ag-Cu-Bi Solder Joints After Thermal Cycling
Journal of Electronic Materials·2025· 6 citedOpen Access
Investigating the Castability of Recycling AZ91 Machining Chips Through Shape Casting
˜The œminerals, metals & materials series·2025
Understanding the deformation creep and role of intermetallic compound-microstructure in Sn-Ag-Cu solders
Materials Science and Engineering A·2024· 7 citedOpen Access
Misorientations and Subgrains in Sn-Ag and Sn-Ag-Cu Solder Balls After Solidification
Journal of Electronic Materials·2024· 3 citedOpen Access
Dendrite Growth in Single-Grain and Cyclic-Twinned Sn–3Ag–0.5Cu Solder Joints
Metallurgical and Materials Transactions A·2024· 2 citedOpen Access
Grain refinement of magnesium castings using recycled machining chips
Materials & Design·2024· 12 citedOpen Access
The role of microstructure in the thermal fatigue of solder joints
Nature Communications·2024· 48 citedOpen Access
Effects of Shot Sleeve Pre-solidification on the Microstructure and Tensile Properties of High Pressure Die Cast AE44
Metallurgical and Materials Transactions A·2024· 5 citedOpen Access
Mechanistic understanding of microstructural effects on the thermal fatigue resistance of solder joints
Journal of the Mechanics and Physics of Solids·2024· 19 citedOpen Access
Grain Refinement of Magnesium Castings Using Recycled Machining Chips
SSRN Electronic Journal·2024· 6 citedOpen Access
Al-Mn-based decagonal quasicrystal in AZ magnesium alloys and its nucleation on Al8Mn5 during solidification
Scripta Materialia·2023· 9 citedOpen Access
The role of microstructure in the thermal fatigue of solder joints
arXiv (Cornell University)·2023Open Access
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Frequent Co-authors

S. Belyakov(16), A. K. Dahle(15), Kazuhiro Nogita(15), Jingwei Xian(13), Hideyuki Yasuda(10), H.I. Laukli(8), Zhaolong Ma(7), Stuart D. McDonald(5), T. Nishimura(4), Tomoya Nagira(4), Guang Zeng(4), Kentaro Uesugi(3), Somboon Otarawanna(3), J. Read(3), Yilun Xu(3), Fionn P.E. Dunne(3), Minh‐Son Pham(2), Bogdan Dovgyy(2), Paul A. Hooper(2), Alessandro Piglione(2)