Woosung Park

Hanyang University — South Korea

Materials Science · Physical Sciences

23h-index1.4kcitations134works1.32yr avg
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Research Topics

Thermal properties of materials(27), Advanced Thermoelectric Materials and Devices(13), Thermal Radiation and Cooling Technologies(11), Heat Transfer and Optimization(8), Electrocatalysts for Energy Conversion(7)

Publications134 total

Quantitative analysis of heat dissipation in a micro thermal stage for a broad temperature operation
Case Studies in Thermal Engineering·2025Open Access
A Scalable N-Level Dickson Charge Pump Based 12 V to 1–1.8 V Hybrid Buck Converter
IEEE Transactions on Power Electronics·2025
Achieving Wide Voltage-Conversion-Ratio and Reduced Power Losses for High Efficiency With EVCR Buck Converter for a 1.8 V Power Rail
IEEE Transactions on Power Electronics·2025· 1 cited
A review in thermal management for advanced chip packaging from chip to heat sink
Microelectronics Reliability·2025· 12 cited
Accuracy Assessment of DEMs Based on Different Control Point Types Using KOMPSAT-5 Imagery and RPC Model
Journal of the Korean Society of Surveying Geodesy Photogrammetry and Cartography·2025
Investigation of thermal transport across volume-controlled thermal interface materials
Polymer Testing·2025· 2 citedOpen Access
Quantitative analysis of heat dissipation in a micro thermal stage for a broad temperature operation
SSRN Electronic Journal·2025Open Access
Investigation of Thermal Transport Across Volume-Controlled Thermal Interface Materials
SSRN Electronic Journal·2025Open Access
Impact of Static Electric Field on Dielectrophoretic Alignment of Silicon Nanowires
Advanced Materials Interfaces·2024· 1 citedOpen Access
Thermometric profiling of capacitive micromachined ultrasonic transducer surface via micro-fabricated fractal resistive thermometer
2024· 1 cited
In-situ Performance Evaluation of silicon-Based Ultrasonic Transducer Under Extreme Thermal Conditions
2024
Frequency dependence of nanorod self-alignment using microfluidic methods
Nanotechnology·2024Open Access
Investigation of Thermal Transport Across Volume-Controlled Thermal Interface Materials
SSRN Electronic Journal·2024Open Access
High Thermal Conductivity of Submicrometer Aluminum Nitride Thin Films Sputter-Deposited at Low Temperature
ACS Nano·2023· 49 cited
Thermoelectric hotspot cooling using thermally conductive fillers
Applied Thermal Engineering·2023· 10 citedOpen Access
Observation of Highly Anisotropic Thermal Expansion of Polymer Films
ACS Applied Materials & Interfaces·2023· 6 cited
Determinants of the job seekers’ intention of the acceptance for the artificial intelligence interview
Asia-Pacific Journal of Business & Commerce·2022
Thermoelectric hotspot cooling using thermally conductive fillers
2022· 1 citedOpen Access
Dominant Energy Carrier Transitions and Thermal Anisotropy in Epitaxial Iridium Thin Films
Advanced Functional Materials·2022· 11 citedOpen Access
Numerical Analysis of the Impact of Operating Parameters on the Polarization Characteristics of Solid-oxide Fuel Cells
Korean Journal of Air-Conditioning and Refrigeration Engineering·2022
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Frequent Co-authors

Kenneth E. Goodson(20), Mehdi Asheghi(14), Uk Sim(10), Joonsuk Park(9), Takashi Kodama(6), Subramani Surendran(6), Michael T. Barako(5), Christopher Perez(5), Hyun Soo Han(5), Brian S. Y. Kim(5), Amy Marconnet(4), Aditya Sood(4), Heungdong Kwon(4), Gnanaprakasam Janani(3), Yujin Chae(3), Yelyn Sim(3), Jung Kyu Kim(3), Soo Jin Kim(3), In Sun Cho(3), Jeeyoung Shin(3)