F. Furuta

Fermi National Accelerator Laboratory — United States

Physics and Astronomy · Physical Sciences

10h-index444citations71works0.02yr avg
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Research Topics

Physics of Superconductivity and Magnetism(17), Quantum and electron transport phenomena(17), Photocathodes and Microchannel Plates(16), Particle Accelerators and Free-Electron Lasers(12), Analog and Mixed-Signal Circuit Design(11)

Publications71 total

Extreme temperature fiber Bragg grating sensors for superconducting magnet and spacecraft applications
2025
Robust multiplexed pultruded sensor arrays for accelerator cryomodules
2025
Robust DC microgrid operation with power routing capabilities
Energy Reports·2021· 3 citedOpen Access
3D Integrated CMOS Device by Using Wafer Stacking and Via-last TSV
IEICE Technical Report; IEICE Tech. Rep.·2014
READINESS FOR THE CORNELL ERL
2013
Fabricating 3D integrated CMOS devices by using wafer stacking and via-last TSV technologies
2013· 31 cited
Circuit design for 3D-stacking using TSV interconnects
Technical report of IEICE. ICD·2013
Scalable 3D-FPGA using wafer-to-wafer TSV interconnect of 15 Tbps/W, 3.3 Tbps/mm 2
2013· 7 cited
Reducing IR drop in 3D integration to less than 1/4 using Buck Converter on Top die (BCT) scheme
2013· 11 cited
Cornell VEP Update, VT Results and R&D on Nb Coupon
2013
Three-dimensional integration scheme using hybrid wafer bonding and via-last TSV process
2012· 2 cited
Demonstration of inter-chip data transmission in a three-dimensional stacked chip fabricated by chip-level TSV integration
2012· 7 cited
6 Tbps/W, 1 Tbps/mm<sup>2</sup>, 3D interconnect using adaptive timing control and low capacitance TSV
2012· 2 cited
Chip-level TSV integration for rapid prototyping of 3D system LSIs
2012
FPC‐free LCD panel with capacitive coupling for transmission of signals and power
Journal of the Society for Information Display·2010· 1 cited
Status of 200 keV Beam Operations at Nagoya University
AIP conference proceedings·2009· 1 cited
62.1L: <i>Late‐News Paper</i> : FPC‐free Panel with Capacitive Coupling for Transmission of Signal and Power
SID Symposium Digest of Technical Papers·2008· 2 cited
Superconductor/Semiconductor Hybrid Analog-to-Digital Converter
IEICE Transactions on Electronics·2008· 2 cited
Characterization of sigma–delta modulator with LR-type integrator for superconducting analog-to-digital converter
Physica C Superconductivity·2007
Experimental Evaluation of Signal-to-Noise Ratio of Sigma-Delta Modulator for Superconducting Analog-to-Digital Converter
IEEE Transactions on Applied Superconductivity·2007· 3 cited
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Frequent Co-authors

K. Saitoh(14), Shoji Okumi(11), T. Nakanishi(10), Hiroshi Matsumoto(9), T. Nishitani(8), Naoto Yamamoto(8), Kazuaki Togawa(8), M. Yoshioka(8), Makoto Kuwahara(7), C. Suzuki(7), Kenji Wada(7), Akira Fujimaki(7), H. Kobayakawa(6), Hisao Hayakawa(6), Hiromichi Horinaka(5), T. Matsuyama(5), T. Omori(5), T. Baba(5), Manabu Yamamoto(5), Ken’ichi Takeda(5)