Jaibir Sharma

Agency for Science, Technology and Research — Singapore

Engineering · Physical Sciences

12h-index430citations66works2.02yr avg
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Research Topics

Advanced MEMS and NEMS Technologies(39), Acoustic Wave Resonator Technologies(29), Mechanical and Optical Resonators(17), 3D IC and TSV technologies(12), Electronic Packaging and Soldering Technologies(10)

Publications66 total

Development of Temporary Bonding and Debonding (TBDB) Process for Hybrid Bonding Advance Packaging
2025
Stress Compensation Effect in AlN/Mo/AlN/Polysilicon Stack for MEMS Application
2024
Temperature Coefficients of Transverse Elastic Properties of Scandium-Doped Aluminum Nitride (ScAlN) Thin Film Grown on Preformed Cavities
2024
Low-Vacuum Sensing With Silicon-On-Nothing Resonating Membrane
2024· 1 cited
Close Range and High-Resolution Detection of Vibration by Ultrasonic Wave Using Silicon-on-Nothing PMUTs
IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control·2024· 5 cited
Cavity-agnostic acoustofluidic manipulations enabled by guided flexural waves on a membrane acoustic waveguide actuator
Microsystems & Nanoengineering·2024· 6 citedOpen Access
Development of Thick Sc<sub>0.2</sub>Al<sub>0.8</sub>N Film for MEMS Application
2023· 1 cited
Ultra-Low Power MEMS Inertial Switch Based Wake-Up Wireless Sensing Node for Door Lock Monitoring
2023
Ultrasonic Wavefront Computing Architecture on CMOS for Fourier Transform Computation
2023· 1 cited
Cavity-Agnostic Acoustofluidic Functions Enabled by Guided Flexural Waves on a Membrane Acoustic Waveguide Actuator
2023Open Access
Extraction of Material Properties of A Thin Silicon Membrane Embedded in A Piezoelectric Stack
2023· 1 cited
Analysis Of Crosstalk in Binary Weighted Bulk Acoustic Wave Transducers For Ultrasonic Based Fourier Transform Accelerators
2023
Novel Hybrid Simulation Of Large 128 By 128 Pixels Input To Ultrasonic Wavefront Computing Apparatus
2023
Long-Range High-Resolution Imaging With Silicon-on-Nothing ScAlN pMUTs
IEEE Sensors Journal·2023· 12 cited
Recent Advances and Challenges of 2D Fourier Transform Computational Accelerator Using GHz Ultrasonics
2023· 1 cited
MEMS-Silicon Chip Bonding Verification using GHz Pulse-echo Simulation and Measurements
2023· 2 cited
CMOS-Compatible Fine Pitch Al-Al Bonding
2023· 9 cited
Wake-Up IoT Wireless Sensing Node Based on a Low-G Threshold mems Inertial Switch with Reliable Contacts
2023· 4 cited
Microfabricated acoustofluidic membrane acoustic waveguide actuator for highly localized in-droplet dynamic particle manipulation
Lab on a Chip·2023· 17 citedOpen Access
In-line test structures for yield improvement in MEMS/NEMS device
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)·2022
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Frequent Co-authors

Amit Lal(16), Srinivas Merugu(15), Eldwin J. Ng(15), Navab Singh(13), Daniel Ssu-Han Chen(11), Duan Jian Goh(10), Sagnik Ghosh(9), Yul Koh(8), Joshua E.-Y. Lee(8), David Sze Wai Choong(5), Sven Holmström(5), Hakan Ürey(5), Jae-Wung Lee(5), Bangtao Chen(4), Amitava DasGupta(4), Chengkuo Lee(4), Mantalena Sarafianou(4), Eva Leong Ching Wai(4), Kevin Tshun Chuan Chai(4), Yul Koh(4)