Allison T. Osmanson

The University of Texas at Arlington — United States

Engineering · Physical Sciences

9h-index318citations24works0.02yr avg
OpenAlex↗Google Scholar↗Lab page↗

Accepting Students?

No reports yet. Know if this professor is taking students?

Research Topics

Electronic Packaging and Soldering Technologies(9), Copper Interconnects and Reliability(8), 3D IC and TSV technologies(7), Polymer Nanocomposites and Properties(4), Polymer crystallization and properties(3)

Publications24 total

Observation of Fatigue and Creep Ratcheting Failure in Solder Joints under Pulsed Direct Current Electromigration Testing
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)·2022· 2 cited
Study of Failure and Microstructural Evolution in SAC Solder Interconnects Induced by AC Electromigration Condition
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)·2022· 2 cited
Study of Metallurgical Reaction and Electromigration Mechanism in Microbump with Embedded Cu Ball
2021· 2 cited
Relationship Between the Grain Orientation and the Electromigration Reliability of Electronic Packaging Interconnects
2021· 5 cited
Electromigration Effect on the Pd Coated Cu Wirebond
2021· 9 cited
Erratum to “From mechanics to thermodynamics: A relation between the brittleness and the thermal expansivity for polymers”
Materials Letters X·2021Open Access
Erratum to “From mechanics to thermodynamics: A relation between the brittleness and the thermal expansivity for polymers” [Mater. Lett.: X 1 (2019) 100005]
Materials Letters X·2021· 1 citedOpen Access
Mechanisms of Contact Formation and Electromigration Reliability in Wirebond Packages
2021· 2 cited
Current Crowding and Stress Effects in WCSP Solder Interconnects: A Simulative and Practical Study about the Effects of Major Electromigration Failure Mechanisms in DC and Pulsed-DC Conditions
2020· 3 cited
Current Crowding and Stress Effects in WCSP Solder Interconnects: A Simulative and Practical Study about the Effects of Major Electromigration Failure Mechanisms in DC and Pulsed-DC Conditions
Wafer-Level Packaging Symposium·2020
Properties of lightweight concrete blocks with waste zeolitic tuff
Materials Science·2020· 9 citedOpen Access
Study of Electromigration Failure in Solder Interconnects under Low Frequency Pulsed Direct Current Condition
2020· 6 cited
Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects
2020· 4 cited
Effects of UV Stabilizers on Polypropylene Outdoors
Materials·2020· 32 citedOpen Access
Flexibility of Polymers Defined and Related to Dynamic Friction
Journal of Materials Science Research·2019· 13 citedOpen Access
From mechanics to thermodynamics: A relation between the brittleness and the thermal expansivity for polymers
Materials Letters X·2019· 9 citedOpen Access
Nano-Al (OH)3 and Mg (OH)2 as flame retardants for polypropylene used on wires and cables
Emergent Materials·2018· 26 cited
Separation of metal and plastic wastes from wire and cable manufacturing for effective recycling
Resources Conservation and Recycling·2018· 21 cited
Facile continuous production of soy peptide nanogels via nanoscale flash desolvation for drug entrapment
International Journal of Pharmaceutics·2018· 17 cited
Defining a Relationship between the Flexibility of Materials and Other Properties
2018Open Access
page 1 of 2Next →

Frequent Co-authors

Witold Brostow(10), Choong-Un Kim(9), Yi Ram Kim(8), Patrick Thompson(8), Hossein Madanipour(7), Mohsen Tajedini(6), Sven Lohse(5), Qiao Chen(4), Xinyao Lu(3), Li‐Ju Wang(2), Yu‐Chung Chang(2), Lei Li(2), Osman Gençel(2), Haley E. Hagg Lobland(2), Bradley Glasscock(2), M.A. Khan(2), L. Nguyen(2), Xiaoxiao Ge(1), Dan Du(1), Yuehe Lin(1)