Young‐Chang Joo

Seoul National University — South Korea

Materials Science · Physical Sciences

46h-index7.6kcitations334works5.12yr avg
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Research Topics

Copper Interconnects and Reliability(91), Electronic Packaging and Soldering Technologies(90), Semiconductor materials and devices(58), 3D IC and TSV technologies(46), Advanced Sensor and Energy Harvesting Materials(37)

Publications334 total

Estimation of the α/β region in phase diagrams and mechanical properties with heat treatment temperature in Ti-6242 alloy
Journal of Materials Research and Technology·2025Open Access
Electromagnetic interference shielding using metal and MXene thin films
Nature·2025· 5 cited
Characterization of Thermal Conductance of Copper-to-Copper Bonded Interconnects with Metal Passivation for Three-Dimensional Integration
Electronic Materials Letters·2025
Sulfur Extraction for Stoichiometry Control of Cobalt Sulfides by Reducing Gas Annealing
Electronic Materials Letters·2025· 1 cited
Unveiling the reconstruction of copper bimetallic catalysts during CO2 electroreduction
Nature Catalysis·2025· 35 cited
In-situ Stress Analysis of Nickel Nanoparticle Sintering with Metal Additive in Multi-Layer Ceramic Capacitors
Electronic Materials Letters·2025Open Access
Dielectric Bonding Method for 3D Integration Packaging Using Self-Assembled Monolayer
Electronic Materials Letters·2025· 3 cited
Optimization of co-sputtered zinc indium tin oxide-based MOSFET-type sensor for effective NO2 gas detection
Sensors and Actuators B Chemical·2025· 10 cited
Improving Bending Fatigue Lifetime and Interfacial Adhesion of Cu–Mn Flexible Interconnects Using Self-Forming Nanolayer
SSRN Electronic Journal·2025Open Access
Chemisorption Manipulation by Adjusting the Carrier Concentration of the Adsorbent and Its Application to Adsorbate Identification
ACS Materials Letters·2024· 2 cited
Understanding the Electrical Characteristics of Electrochemical Metallization Memristors through Identification of Conduction Channel in Entire Active Area
Electronic Materials Letters·2024· 3 cited
Thermal and Electrical Properties Depending on the Bonding Structure of Amorphous Carbon Thin Films
Electronic Materials Letters·2024· 4 cited
Predictive Synthesis of Transition Metal Carbide via Thermochemical Oxocarbon Equilibrium
Journal of the American Chemical Society·2024· 5 cited
Thermal Transport Properties of Hybrid Bonding With Passivation
2024· 3 cited
Bonding structure and dry etching characteristics in amorphous B–C–N films for hardmask applications
Carbon·2024· 2 cited
Effect of Ag agglomeration-driven nanovoids formation on fatigue reliability of Cu–Ag alloy flexible interconnects
Journal of Materials Research and Technology·2024· 5 citedOpen Access
Indolocarbazole‐Based Small Molecule Cathode‐Active Material Exhibiting Double Redox for High‐Voltage Li‐Organic Batteries
Energy & environment materials·2024· 10 citedOpen Access
Thermodynamic phase control of Cu–Sn alloy electrocatalysts for selective CO<sub>2</sub> reduction
Nanoscale Horizons·2024· 8 cited
Bonding Structure and Etching Characteristics in B and N Co-Doped Amorphous Carbon Films for Hardmask Applications
SSRN Electronic Journal·2024Open Access
Selective hydrocarbon or oxygenate production in CO2 electroreduction over metallurgical alloy catalysts
Nature Synthesis·2023· 28 cited
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Frequent Co-authors

In‐Suk Choi(10), Byoung‐Joon Kim(8), Seungmin Lim(6), Ki Tae Nam(6), Young-Bae Park(6), Jeong‐Yun Sun(5), Dae‐Hyun Nam(5), Tae‐Youl Yang(5), Young Ju Lee(5), Ho‐Young Kang(4), Ji-Yong Kim(4), Miyoung Kim(4), Deokgi Hong(3), Jihun Oh(3), Gun‐Do Lee(3), Hae‐A‐Seul Shin(3), Hae-A-Seul Shin(3), Heung Nam Han(3), Wonhyo Joo(3), Shin-Bok Lee(3)