Peng Zhao

Taiyuan Normal University — China

Engineering · Physical Sciences

14h-index644citations119works2.02yr avg
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Research Topics

Semiconductor materials and devices(23), Photonic and Optical Devices(15), 3D IC and TSV technologies(14), Quantum Information and Cryptography(12), Electronic Packaging and Soldering Technologies(11)

Publications119 total

Flash fabrication of Ti-doped Na3V2(PO4)3 single-crystals with boosted sodium storage and low-temperature performance
Chemical Physics Letters·2025
Enhancing the Interfacial Adhesion of a Ductile Gold Electrode with PDMS Using an Interlocking Structure for Applications in Temperature Sensors
Nanomaterials·2025· 1 citedOpen Access
High-Density Wafer Level Connectivity Using Frontside Hybrid Bonding at 250nm Pitch and Backside Through-Dielectric Vias at 120nm Pitch After Extreme Wafer Thinning
2025· 1 cited
Construction and Evaluation of a Cross-Regional and Cross-Year Monitoring Model for Millet Canopy Phenotype Based on UAV Multispectral Remote Sensing
Agronomy·2025· 4 citedOpen Access
Construction and Evaluation of a Cross-Regional and Cross-Year Monitoring Model for Millet Canopy Phenotype Based on UAV Multispectral Remote Sensing
Preprints.org·2025· 2 citedOpen Access
Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias
IEEE Transactions on Electron Devices·2024· 9 cited
Next-Value Prediction of Beam Waists From Mixed Pitch Grating Using Simplified Transformer Model
IEEE photonics journal·2024· 3 citedOpen Access
Session II / Quantum Information & Computing Trapped and cooled 88Sr+ ions in a cylindrical potential provided by a micro-fabricated ring trap
SPIRE - Sciences Po Institutional REpository·2024Open Access
Design of a Ku-band broadband circularly polarized magneto-electric dipole antenna for satellite communications
Electromagnetics·2024· 6 cited
Backside Power Delivery with relaxed overlay for backside patterning using extreme wafer thinning and Molybdenum-filled slit nano Through Silicon Vias
2024
Research on AIGC-driven Innovation Path and Smart Creative Workflow Optimization in Design Field
Applied Mathematics and Nonlinear Sciences·2024Open Access
A Cluster Analysis Study on the Relevance of Innovation Design and Development Influencing Factors in Dehua Ceramics Industry
Applied Mathematics and Nonlinear Sciences·2024Open Access
Investigation on In-Flight Heating Process of Cerium Oxide Powders in Radio Frequency Thermal Plasma Considering Thermal Resistance Effect
SSRN Electronic Journal·2024Open Access
CMOS-Fabricated Ring Surface Ion Trap with TSV Integration
2023· 3 cited
Modeling and Predicting the Beam Properties from Grating Structures Using Deep Neural Network
2023· 4 cited
Broadband dual-polarized antenna array with enhanced radiation pattern stability
Electromagnetics·2023· 2 cited
Predictive Modelling of Optical Beams From Grating Structure Using Deep Neural Network
Journal of Lightwave Technology·2023· 13 citedOpen Access
Simplified Assembly of Through-Silicon-Via Integrated Ion Traps
IEEE Transactions on Components Packaging and Manufacturing Technology·2023· 3 citedOpen Access
Effects of physical parameters of graded AlGaN buffer on DC characteristic and short-channel effects in AlInN/GaN high-electron mobility transistors
Microelectronics Journal·2023· 7 cited
Development of Grating for the Optical Addressing of Sr<sup>+</sup> Ions With Data Analysis Techniques
IEEE photonics journal·2023· 16 citedOpen Access
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Frequent Co-authors

Chuan Seng Tan(28), Yu Dian Lim(24), L. Guidoni(18), Jing Tao(17), Hong Yu Li(12), J.-P. Likforman(7), Liangxing Hu(7), Michael Joo Zhong Lim(7), T. P. Chen(6), S. Fung(5), C. Y. Ng(5), Simon Chun Kiat Goh(5), Wen Wei Seit(5), Anak Agung Alit Apriyana(5), Rusli Rusli(4), M.S. Tse(3), Y. Liu(3), C. C. Tin(3), Yu Dian Lim(3), Sam Zhang(2)