Xuejun Fan

Shandong University — China

Engineering · Physical Sciences

43h-index7.2kcitations437works2.82yr avg
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Research Topics

Electronic Packaging and Soldering Technologies(165), 3D IC and TSV technologies(72), GaN-based semiconductor devices and materials(58), Mechanical Behavior of Composites(38), Combustion and flame dynamics(38)

Publications436 total

Synergistic enhancement of breakdown and dielectric properties in dielectric energy storage polymer via incorporating TiO2-loaded Al2O3 nanotube featuring “cable-tie-like” composite structure
Chemical Engineering Journal·2025
Combustion characteristics of strut-injection supersonic combustor with local oxygen enrichment
Physics of Fluids·2025
Liquid sputtering: a route to incorporate mono-dispersed metal nanoparticles into polymer films towards high-temperature dielectric energy storage
Chemical Engineering Journal·2025
Comparative Analysis of Oxygen- and Air-Assisted Atomization in Supersonic Combustion
AIAA Journal·2025
Multi-party post-quantum key exchange schemes
Journal of Information Security and Applications·2025
Analytical prediction of thermomechanical shear strain in solder joints with FEA validation in electronic packaging
Frontiers in Electronics·2025· 1 citedOpen Access
Tailoring microstructure and mechanical properties of sintered Cu nanoparticles
Acta Materialia·2025· 4 citedOpen Access
Excellent high-temperature breakdown and energy storage performances of polyetherimide dielectric film with silver/alumina nanosheets derived from sequential bimetallic ion exchange
Journal of Colloid and Interface Science·2025
Effects of Al addition on the mechanical and corrosion properties of NbTaTiV high-entropy alloy
Journal of Alloys and Compounds·2025· 2 cited
Nondestructive analysis of interface damage and stress in Al-ion implanted 4H-SiC homoepitaxial wafers via micro-Raman and multiscale simulation
Applied Surface Science·2025· 5 cited
Strain rate and temperature dependent viscoplasticity of sintered Cu nanoparticles
Materials & Design·2025Open Access
Online verbal aggression on interpersonal trust among college students: the chain-mediating effect of core self-evaluation and emotional intelligence
Frontiers in Psychiatry·2025· 1 citedOpen Access
Interface strength and crack propagation mechanisms in sintered copper nanoparticles
Acta Materialia·2025· 2 citedOpen Access
Significantly Boosted High-Temperature energy storage of polyetherimide film induced by BaTiO3/Al2O3/Ag composites nanofibers
Composites Part A Applied Science and Manufacturing·2025· 2 cited
In-Situ Confocal Raman Spectroscopy Assisted Interfacial Residual Stress Characterization in SiC Chip Sintered on AMB Substrate with Nanocopper Paste
2025
Enhanced Thermal Management of a 1.2 kV SiC MOSFET Half-Bridgec Fan-Out Panel-Level Packaging with Nanocopper Sintering Die-Attachment
2025
Characterization of Moisture Diffusion Properties of ABF and Mold Compounds in Molded Package with High Copper Density Substrate
2025· 1 cited
Research on Sensorless Control System of Permanent Magnet Synchronous Motor Based on Improved Fuzzy Super Twisted Sliding Mode Observer
Electronics·2025· 1 citedOpen Access
Decoupling of nanoindentation residual stress field in single-crystalline 4H-SiC via micro-Raman spectroscopy
Optics Letters·2025· 2 cited
Plural Legal System under a Unitary State: Jurisdictional Conflicts in Cross-Border Commercial Disputes in the Greater Bay Area and Lessons from the EU Experience
Transformative Society·2025· 3 citedOpen Access
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Frequent Co-authors

Guoqi Zhang(13), W.D. van Driel(9), Jiajie Fan(9), G. Q. Zhang(5), Cheng Qian(5), Sau Koh(5), Daoguo Yang(5), G.Q. Zhang(4), L.J. Ernst(4), Jianlin Huang(4), D. S. Golubović(4), Xiupeng Li(4), Qiang Han(3), Huaiyu Ye(3), Bo Sun(3), Xianping Chen(2), Huaiyu Ye(2), Tian‐Ling Ren(2), Hongyu Tang(2), Leandro Sacco(2)