Chih‐Ming Chen

National Chung Hsing University — Taiwan

Engineering · Physical Sciences

37h-index5.6kcitations313works6.82yr avg
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Research Topics

Electronic Packaging and Soldering Technologies(115), 3D IC and TSV technologies(61), Copper Interconnects and Reliability(40), TiO2 Photocatalysis and Solar Cells(39), Advanced Photocatalysis Techniques(33)

Publications313 total

Liquid/Solid Interfacial Reactions Between Lead-Free Solders and Cu-6.01wt.% Sn-0.12wt.%P Alloy
Journal of Electronic Materials·2025
Unidirectional cross-interface grain growth in Cu–Cu direct bonding
Journal of Materials Research and Technology·2025· 1 citedOpen Access
Nanograin‐Twin‐Nanograin Alternating Composite Structure Enable Improved Cross‐Interface Cu─Cu Bonding at Low Thermal Budgets
Small Methods·2025· 6 cited
Effect of entropy stabilization on high entropy brownmillerites for boosting oxygen evolution reaction
Electrochimica Acta·2025· 6 cited
Bismuth-induced microstructural evolution and dissolution during aging: Enhancing mechanical properties, thermal stability, and wettability of Sn-9Zn alloy
Journal of Alloys and Compounds·2025· 5 cited
Interfacial Reactions in Sn/Ag/Cu Sandwiched Structure
2025
Ex-situ observation of microstructure evolution and electrical resistance transition in micro joints under electron current stressing
Surface and Coatings Technology·2025· 2 cited
Pinhole formation and its mitigation for Cu electrodeposition on the Ajinomoto build-up film (ABF) with different surface roughnesses
Journal of Materials Research and Technology·2025· 4 citedOpen Access
Microstructures of Sn-5Sb/Sn-58Bi mixed solder and its interfacial reaction with copper
Journal of Materials Science Materials in Electronics·2025· 2 cited
Effect of Bi Addition on Melting Behavior, Solder Joint Strength, and Thermal Aging Resistance of Sn-3.5Ag/Cu Joints
JOM·2025· 8 cited
Exploring spinel oxides from bimetallic to high-entropy with a focus on the structure and performance in the oxygen evolution reaction
Journal of Materials Chemistry A·2025· 14 cited
Machine learning-assisted optimization design for enhanced oxygen evolution reaction based on vanadium-doped nickel–cobalt layered double hydroxides
Journal of Materials Chemistry A·2025· 7 cited
Electrochemically enhanced oxygen evolution and urea oxidation reactions with advanced high-entropy LDH nanoneedles
Sustainable Energy & Fuels·2025· 12 cited
Interfacial reaction and thermomigration of copper/indium joints
Journal of Materials Research and Technology·2024· 5 citedOpen Access
Genetic characteristic of class 1 integrons in proteus mirabilis isolates from urine samples
Biomedicine·2024Open Access
Low-temperature soldering using Sn/Bi electrodeposited bilayer
Materials Science in Semiconductor Processing·2024· 3 cited
Investigating microstructure and interfacial stability of Bi-enhanced Sn-9Zn alloy on electroplated Cu during aging
Materials Science in Semiconductor Processing·2024· 4 cited
Photocurrent enhancement in dye-sensitized solar cells by polyimide covalent organic frameworks decorated with silver nanoparticles
Journal of Photochemistry and Photobiology A Chemistry·2024· 3 cited
A composite electrocatalytic poly(3,4-ethylenedioxythiophene) film incorporated with silver nanowires for bifacial dye-sensitized solar cells
Electrochimica Acta·2024· 2 cited
Engineering of uniform anisotropic interconnection system with polyimide films for flexible electronics
Ain Shams Engineering Journal·2024Open Access
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Frequent Co-authors

Sinn-wen Chen(8), Hsuan Lee(4), Manik Chandra Sil(4), Cheng‐Chung Chang(4), Tzu‐Chien Wei(3), Ray‐Hua Horng(3), Dong‐Sing Wuu(3), Ching Hsuan Lin(3), Long-Tai Chen(2), Kamani Sudhir K. Reddy(2), Chen‐Yu Yeh(2), Yün Chi(2), Wei‐Ping Dow(2), Chih-chieh Huang(2), Jhih-Sin Hong(2), Chia-Ju Chen(2), Tzu-Jung Liu(2), Hsi-Kuei Cheng(2), Lii-Tzu Wu(2), Jyun-Wei Chen(2)