Guo‐Quan Lu

State Grid Corporation of China (China) — China

Engineering · Physical Sciences

51h-index9.5kcitations370works2.22yr avg
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Research Topics

Electronic Packaging and Soldering Technologies(180), 3D IC and TSV technologies(135), Silicon Carbide Semiconductor Technologies(110), Electromagnetic Compatibility and Noise Suppression(49), Aluminum Alloys Composites Properties(37)

Publications370 total

A Novel Additive Manufactured Polymer-Based Liquid Cooling System (AMPoLiCoolS) for Double-Sided Cooled Power Modules
2025
Effect of Moisture on the Field-Grading of a Polymer Nanocomposite Coating in Medium-Voltage Power Modules
2025
Double-Sided Liquid Cooling of a 1.2 kV SiC Three- Phase Traction Inverter Power Stage
2025
Packaging of a Double-Side Cooled 3.3 kV, 100 A SiC MOSFET Phase-Leg Module
2025
Low-Pressure (5 MPa) and Short-Time (3 min) Silver-Sintering Die-Attach
2025
Dimensional Parasitics Absorption in Capacitively-Isolated Ćuk Converter for Medium-Voltage High Step-Down Converters
2025· 1 cited
Indented Core to Reduce and Desensitize Inductor’s Fringing Losses without Increasing Volume
2025
Experimental Study on Infrared Characteristics of Composite Insulator Defects
Lecture notes in electrical engineering·2025
High-voltage SiC Power Module Packaging
2025
Optimization and Scheduling Method for Carbon Neutral Fuel Synthesis System Driven by Photoelectricity
2024
Provenance study on metal materials of the bronze weapons foundry site (2019 field session) in the ancient capital of the Zhu State, Shandong, China
Journal of Archaeological Science Reports·2024· 3 cited
A SiC-Based 200°C 1200-V Half-Bridge Phase-Leg Integrated with High-Density Power Supply and Novel Current Sensor based on Parasitic Inductance
2024
Double-Side Cooled 3.3 kV, 100 A SiC MOSFET Phase-Leg Modules for Traction Applications
2024· 2 cited
Beyond Two-Dimensional Losses in Solenoidal Inductors with Distributed Gaps
2024
A Low-Profile Gate Power Supply for a SiC Phase Leg with Reduced Isolation Capacitance
2024
Bonding and Failure Mechanisms of Sintered-Silver Die-Attach on Electroless Nickel (Phosphorus) Surface Finish for Packaging Power Electronics Modules
IEEE Transactions on Power Electronics·2024· 1 cited
Insulation Capability at 10 kV, >300 V/ns of a Nonlinear Resistive Polymer Nanocomposite Field-Grading Coating in a 15-kV Silicon Carbide Module
IEEE Transactions on Power Electronics·2024· 5 cited
Physiological–Biochemical Characteristics and a Transcriptomic Profiling Analysis Reveal the Postharvest Wound Healing Mechanisms of Sweet Potatoes under Ascorbic Acid Treatment
Foods·2024· 5 citedOpen Access
Heterogeneous Integration Technologies for High-temperature, High-density,Low-profile Power Modules of Wide Bandgap Devices in Electric DriveApplications
2024· 1 citedOpen Access
Double-Sided Cooling Half-Bridge Power Module of 650V/150A Gallium Nitride High-Electron-Mobility Transistor
IEEE Transactions on Industrial Electronics·2024· 9 cited
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Frequent Co-authors

Yunhui Mei(13), Xu Chen(11), Khai D. T. Ngo(9), Jesus N. Calata(8), John G. Bai(7), Gang Chen(5), Xin Li(5), Thomas G. Lei(4), Dushan Boroyevich(4), Meiyu Wang(4), Xingsheng Liu(4), Tao Wang(3), Shancan Fu(3), S. Haque(3), Xin Li(3), Guangyin Lei(2), Shufang Luo(2), Zhiye Zhang(2), J.D. van Wyk(2), Michael J. Aziz(2)