Tian-Shiang Yang

National Cheng Kung University — Taiwan

Engineering · Physical Sciences

13h-index523citations56works0.62yr avg
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Research Topics

Advanced Surface Polishing Techniques(10), Advanced Fiber Laser Technologies(7), Adhesion, Friction, and Surface Interactions(7), Optical Network Technologies(6), Laser Material Processing Techniques(5)

Publications56 total

High-Efficiency Extraction Method for Thermal Network Model of Advanced Electronic Packages
IEEE Transactions on Components Packaging and Manufacturing Technology·2025· 2 cited
Measurement of Mechatronic Characteristics and Computation of Hydrodynamic Parameters for Water-Wave Energy Harvesters
2025
Fracture Properties Characterization of Multi-Layer Ceramic Capacitors for Device Longevity Assessment
2024
Clogging monitoring and regeneration of filtration film in wafer cleaning circulation systems for semiconductor manufacturing
The International Journal of Advanced Manufacturing Technology·2024· 1 cited
Numerical Analysis of the Thermal Processes of Binder Burn-out and Curing for MLCC Manufacturing
2024Open Access
Realization and Performance Testing of a Water Wave Energy Harvester
2023Open Access
An Effective Estimation of Uniformity in Chemical Vapor Deposition Thin Film
2023Open Access
Numerical Computation and Optimization of the Flow and Thermal Distributions in MOCVD Reactor
2023Open Access
Prediction of 3D natural convection heat transfer characteristics in a shallow enclosure with experimental data
Progress in Nuclear Energy·2022· 14 cited
A numerical simulation validated experimentally for thermally developing convection characteristics of a phase change nanofluid flow in a circular tube
Case Studies in Thermal Engineering·2021· 3 citedOpen Access
Reconstituted Wafer Deformation Analysis Through Whole Process Emulation
IEEE Transactions on Device and Materials Reliability·2020· 13 cited
Crafting interior holes on chemically strengthened thin glass based on ultrafast laser ablation and thermo-shock crack propagations
Sensors and Actuators A Physical·2019· 13 cited
Design and Realization of a Sensing Module for Machine Tools Status Monitoring by Multiple MEMS Accelerometers Integration
2019· 2 citedOpen Access
Enhancing convective heat transfer for laminar flow in a tube by inserting a concentric inner tube and controlling concurrent flows: a numerical assessment
International Communications in Heat and Mass Transfer·2018· 6 cited
Performance analysis of a water tank with oscillating walls for wave energy harvesting
Journal of Engineering Mathematics·2018
Identification of curing kinetics of epoxy molding compounds and mold flow analysis for assessment of die-shift defects
2017· 5 cited
Process emulation for predicting die shift and wafer warpage in wafer reconstitution
2017· 6 cited
Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications
Microsystem Technologies·2017· 8 cited
Thermo-mechanical and Mold Flow Analyses of Die Shift in Wafer Reconstitution Process for Advanced Packaging Technology
2017· 4 citedOpen Access
On the mechanics of laser peeling for ultra-thin glasses
Engineering Fracture Mechanics·2016· 11 cited
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Frequent Co-authors

Kuo‐Shen Chen(22), William L. Kath(7), Tz-Cheng Chiu(7), Sergei K. Turitsyn(4), T. R. Akylas(3), Kuang-Shun Ou(3), Mao-Chi Lin(3), C.J. Ho(3), Sen-Yung Lee(2), Chang-Da Wen(2), Chun-Han Li(2), Chien-Jung Huang(2), Kun-Tso Chen(2), Ian Hu(2), Cheng‐Ying Yang(2), Y.-C. Wang(2), David Calvo(1), Jui-Feng Yin(1), Yuan-Hsiang Zou(1), Han-Taw Chen(1)