Shu Xuefeng

Vaughn College of Aeronautics and Technology — United States

Engineering · Physical Sciences

9h-index390citations49works3.72yr avg
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Research Topics

Electronic Packaging and Soldering Technologies(15), Material Properties and Processing(10), Mechanical Behavior of Composites(9), Metal and Thin Film Mechanics(7), Cellular and Composite Structures(7)

Publications49 total

Temperature- and stress-dependent creep behavior of SAC305 solder alloy through tensile characterization and CPFE simulation
Materials & Design·2025· 2 citedOpen Access
Experimental investigation on the low-velocity impact responses of hybrid CFRP–elastomer–metal laminates with various rubber layer positions and impact energies
Mechanics of Advanced Materials and Structures·2025· 2 cited
Characterization of shear/tensile mechanical properties of three-dimensional-printed polylactic acid specimens based on orthogonal raster
Polymer Testing·2024· 7 citedOpen Access
Crashworthiness design of hexagonal tubes using self-similar inspired structures
Materials Today Communications·2022· 16 cited
Energy absorption of self-similar inspired multi-cell tubes under quasi-static and dynamic loading
Journal of Materials Research and Technology·2022· 18 citedOpen Access
Dynamic response of single curved fiber-metal hybrid lamina composites subject to low-velocity impact
International Journal of Impact Engineering·2022· 20 cited
Loading rate response on shear mechanical properties of conductive adhesive with different silver contents
Journal of Adhesion Science and Technology·2020· 6 cited
Indentation Strain Rate Sensitivity of CoCrFeNiAl<sub>0.3</sub> High‐Entropy Alloy
Advanced Engineering Materials·2018· 15 cited
WITHDRAWN: Strain rate and temperature effects on the mechanical properties of cured isotropic conductive adhesive (ICA) at micro scale
Mechanics of Materials·2018
Shear properties of isotropic conductive adhesive joints under different loading rates
The Journal of Adhesion·2018· 9 cited
3D meso-scale modeling of reinforcement concrete with high volume fraction of randomly distributed aggregates
Construction and Building Materials·2018· 123 cited
Experimental study on the effects of specimen in-plane size on the mechanical behavior of aluminum hexagonal honeycombs
Materials Science and Engineering A·2015· 56 cited
Uniaxial and biaxial failure behaviors of aluminum alloy foams
Composites Part B Engineering·2013· 53 cited
Effects of solder joint shapes on reliability of BGA packages under board level drop impact loads
Zhendong yu chongji·2013
The Cavity Problem in the Polymeric Electronic Packaging Material
Cailiao daobao·2013
The properties of intermetallic compounds at Sn_(3.0)Ag_(0.5)Cu/Cu joint interface
Journal of Functional Biomaterials·2013Open Access
On the Mechanical Properties of Lead-Free Solder Joints Based on Nanoindentation
Journal of Experimental Mechanics·2013
A nanoindentation study of the mechanical properties of intermetallic compounds in lead-free solder joints
Electronic Components and Materials·2012
Delamination in a class of generalized plastic IC packaging materials due to thermal load and moisture
Journal of Functional Biomaterials·2012Open Access
Nanomechanical Properties Test and Analysis of Ti,TiN and TiO_2 Modified Layers
Journal of Experimental Mechanics·2012· 1 cited
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Frequent Co-authors

Zhigang Li(9), Gesheng Xiao(6), Tao Jin(5), Xin Li(4), Xuexia Yang(4), Xiaoyan Niu(4), Ji Qiu(3), Yang Gui-tong(3), Erqiang Liu(3), Guozheng Yuan(3), Zhiwei Zhou(2), Zhihua Wang(2), Hao Xin(2), Yulong He(2), Buyun Su(2), Xinkuo Ji(2), Yong Ma(2), Xuewen Wang(2), Jie Zhang(1), Zhiyong Wang(1)