Mohamed El-Sayed

Arab Academy for Science, Technology, and Maritime Transport — Egypt

Engineering · Physical Sciences

6h-index131citations24works0.72yr avg
OpenAlex↗Google Scholar↗Lab page↗

Accepting Students?

No reports yet. Know if this professor is taking students?

Research Topics

Antenna Design and Analysis(6), Microwave Engineering and Waveguides(5), 3D IC and TSV technologies(5), Interconnection Networks and Systems(4), Advanced Antenna and Metasurface Technologies(4)

Publications24 total

Thermo- and photophoretic mobilities of an oscillating spherical aerosol particle
Physics of Fluids·2025· 2 cited
USING DEMING’S PDCA CYCLE TO MANAGE CAPSTONE PROJECTS’ PHASES
EDULEARN proceedings·2025
2023–2024 Reviewers
SAE International Journal of Passenger Vehicle Systems·2024
Thermophoresis of a spherical particle in a permeable microchannel with thermal stress slip
Physical Review Fluids·2023· 23 cited
Achieving Capstone Design Objectives During Necessitated COVID-19 Online Teaching
2021 ASEE Virtual Annual Conference Content Access Proceedings·2021· 3 citedOpen Access
Compact wide band antenna for millimetric communications
IOP Conference Series Materials Science and Engineering·2021· 4 citedOpen Access
Implementation and Assessment of a Capstone Course Designed to Achieve Pprogram Learning Objectives
2020Open Access
Integration of Environmental Sustainability with Capstone Experience
2020· 2 citedOpen Access
A Complete Product Design Realization Experience Through Integrating A Computer Integrated Manufacturing Course With An Automotive Capstone
2020· 1 citedOpen Access
A Dual Band Rectangular Patch Antenna for 5G Applications
2020· 4 cited
Design and Development of a Semi-Autonomous Trailer Concept
SAE International Journal of Connected and Automated Vehicles·2019
Resin Composites-to-Resin Based Lining Materials Bond Strength
Ain Shams Dental Journal·2018Open Access
Fundamentals of Integrated Vehicle Realization
SAE International eBooks·2017· 3 cited
Zn拡散GaAsにおけるAs空孔複合体:陽電子寿命分光法による研究【Powered by NICT】
Scripta Materialia·2017
A design methodology and various performance and fabrication metrics evaluation of 3D Network-on-Chip with multiplexed Through-Silicon Vias
Microprocessors and Microsystems·2016· 3 cited
A Design Methodology for Performance Maintenance of 3D Network-on-Chip with Multiplexed Through-Silicon Vias
2015· 2 cited
Keep-Out-Zone analysis for three-dimensional ICs
2014· 3 citedOpen Access
Thermal analysis of three-dimensional ICs, investigating the effect of through-silicon vias and fabrication parameters
2013· 3 cited
Improving Performance and Fabrication Metrics of Three-Dimensional ICs by Multiplexing Through-Silicon Vias
2013· 5 cited
Compact size high gain AoC using rectangular AMC in CMOS for 60 GHz millimeter wave applications
2013· 11 cited
page 1 of 2Next →

Frequent Co-authors

Mostafa Said(5), Farhad Mehdipour(5), Jacqueline El-Sayed(5), Ahmed Allam(4), Keiji Yoshida(4), Adel Barakat(3), Ramesh K. Pokharel(3), Hala Elsadek(3), Ahmed Shalaby(2), M. S. Faltas(2), M. G. Nashwan(2), Mostafa S. Sayed(1), Victor Goulart(1), Hany H. Sherief(1), Allam A. Allam(1), Emad Tammam(1), Kuniaki Yoshitomi(1), Haruichi Kanaya(1), Mohamed Fathy Abo Sree(1), Mohamed H. Abd ElAzeem(1)