Kejun Zeng

Hunan University — China

Engineering · Physical Sciences

19h-index1.7kcitations53works2.92yr avg
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Research Topics

Electronic Packaging and Soldering Technologies(18), 3D IC and TSV technologies(13), Advanced Welding Techniques Analysis(7), Intermetallics and Advanced Alloy Properties(7), Copper Interconnects and Reliability(7)

Publications52 total

Occupant-Centric Control of Split Air Conditioners, Personal Desktop Fans and Lights Based on Wi-Fi Probe Technology
Buildings·2025Open Access
Evaluation of Au-Si Eutectic Die-Attach for Power Hermetic Packages in Space Applications
IMAPSource Proceedings·2025Open Access
An occupant-centric control case study based on internet of things and data mining for an office space
Journal of Building Engineering·2025· 3 cited
Retrofit Analysis of Exterior Windows for Large Office Buildings in Different Climate Zones of China
Buildings·2024· 5 citedOpen Access
A review of current research on occupant-centric control for improving comfort and energy efficiency
Building Simulation·2024· 12 cited
Schatten classes on noncommutative tori: Kernel conditions
arXiv (Cornell University)·2024Open Access
Solder Reaction with Cu Alloy C7025 and Its Effect on Solder Joint Reliability
2024
Space-Level air conditioner electricity consumption and occupant behavior analysis on a university campus
Energy and Buildings·2023· 22 cited
Enhanced Operation of Ice Storage System for Peak Load Management in Shopping Malls across Diverse Climate Zones
Sustainability·2023· 5 citedOpen Access
System-Level Reliability Case Studies of High-Performance Automotive and Medical IC Packages
2023· 4 cited
Dynamic Patterns of N6‐Methyladenosine Profiles of Messenger RNA Correlated with the Cardiomyocyte Regenerability during the Early Heart Development in Mice
Oxidative Medicine and Cellular Longevity·2021· 19 citedOpen Access
Knowledge Reasoning Method for Military Decision Support Knowledge Graph Mixing Rule and Graph Neural Networks Learning together
2020· 12 cited
Improve Interconnect Reliability of BGA Substrate with Stacked Vias by Reducing Carbon Inclusion in the Interface Between Via and Land Pad
2018· 7 cited
Reduction of Cu-Ni-Pd pad discoloration caused by Cu re-deposition
2016
Extending Relational Query Languages for Data Streams
Data-centric systems and applications·2016· 3 cited
Cu再堆積によるCu Ni Pdパッド変色の減少【Powered by NICT】
IEEE Conference Proceedings·2016
De-noising Method Based on Kernel Adaptive Filtering for Telemetry Vibration Signal of the Vehicle Test
2016Open Access
Effect of high temperature bake on evolution of interfacial structure in Cu wire bonds and its impact on Cu/Al interfacial corrosion
2015· 7 cited
Thermal cycling reliability of SnAgCu solder joints in WLCSP
2014· 7 cited
Optimization of Pb-Free Solder Joint Reliability from a Metallurgical Perspective
Journal of Electronic Materials·2011· 15 cited
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Frequent Co-authors

J.K. Kivilahti(9), Tomi Laurila(6), Yixing Chen(6), R.J. Stierman(5), Jyrki Molarius(5), I. Suni(5), Yue Yuan(5), Liying Gao(4), Masood Murtuza(3), Marko Hämäläinen(3), Amit Nangia(3), Tz-Cheng Chiu(2), Kazuaki Ano(2), Vesa Vuorinen(2), Thomas Klassen(2), W. Oelerich(2), R. Bormann(2), D.C. Abbott(2), Rainer Schmid‐Fetzer(2), Jin Zhanpeng(2)