T. S. Sriram

Engineering · Physical Sciences

12h-index494citations32works0.02yr avg
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Research Topics

Semiconductor materials and devices(5), Force Microscopy Techniques and Applications(5), Copper Interconnects and Reliability(5), Semiconductor materials and interfaces(5), Electronic Packaging and Soldering Technologies(4)

Publications32 total

Computational Study of Airfoil Aerodynamics in Subsonic Flow Using ANSYS Fluent
International Journal of Research Publication and Reviews·2025Open Access
Submersible Water Pump with Sand and Sediment Filter
2023
Synthesis of copper nanoparticles from the leaf extract of Psidium guajava L. and its antioxidant, anticancer, antifungal activities
Annals of Phytomedicine An International Journal·2023· 3 citedOpen Access
High density penetrating electrode arrays for autonomic nerves
2016· 2 cited
Ultra-high density packaging technology for injectable medical devices
2011· 1 cited
A low dark current and high quantum efficiency monolithic germanium-on-silicon CMOS imager technology for day and night imaging applications
2010· 26 cited
Wide-band imaging for enhanced day and night vision
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2010
Monolithic germanium SWIR imaging array
2008· 11 cited
Monolithic germanium SWIR imaging array
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2008· 9 cited
Soft error considerations for deep-submicron CMOS circuit applications
2003· 84 cited
Electromigration test structure designed to identify via failure modes
2002· 1 cited
Performance and Reliability of a MEMS-based tunable optical filter operating in the 1565 nm-1525 nm wavelength range
MRS Proceedings·2002
Integration of chemical vapor deposition titanium nitride for 0.25 μm contacts and vias
Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena·1998· 17 citedOpen Access
The Determination of Copper Composition Profiles in Semiconductor Device Aluminum Interconnect Electromigration Test Lines using Electron Probe Microanalysis (EPMA)
Microscopy and Microanalysis·1998
A thermal microprobe fabricated with wafer-stage processing
Review of Scientific Instruments·1998· 26 cited
Effect of VLSI interconnect layout on electromigration performance
1998· 26 cited
A statistical approach to electromigration design for high performance VLSI
1998
The Effects of Stress on the Respiratory System
1997
Influence of Voed Geometry on Electromigration Failure in Via-Line Structures
MRS Proceedings·1997· 8 cited
Formation of single tips of oxidation-sharpened Si
Applied Physics Letters·1996· 21 cited
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Frequent Co-authors

Ingvar Åberg(4), B. Ackland(4), R. Manjari(3), Yip-Wah Chung(3), M. E. Fine(3), Y. W. Chung(3), Conor Rafferty(3), C. A. King(3), V. C. Joseph(2), L. P. Pandureng(2), U. I. Somasundaran(2), Yongxia Zhang(2), Yanwei Zhang(2), R. B. Marcus(2), J. P. O’Neill(2), Seth Pappas(2), N. Cohen(1), N. Leland(1), D. Moyer(1), S. Butler(1)