John Heck

Intel (United States) — United States

Engineering · Physical Sciences

14h-index1.3kcitations35works0.02yr avg
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Research Topics

Photonic and Optical Devices(15), Semiconductor Lasers and Optical Devices(9), Advanced MEMS and NEMS Technologies(6), Advanced Photonic Communication Systems(6), 3D IC and TSV technologies(6)

Publications35 total

Silicon Photonics for Next-Generation Optical Connectivity
2023· 2 cited
List of contributors
Elsevier eBooks·2023
Silicon Photonics for Next-Generation Optical Connectivity
2023· 19 cited
Photonic-integrated circuit fabrication and test approaches
Elsevier eBooks·2023
8-channel hybrid III-V/silicon DFB laser array with highly uniform 200 GHz spacing and power
2021· 15 cited
Post-Fabrication Trimming of Silicon Photonic Ring Resonators at Wafer-Scale
Journal of Lightwave Technology·2021· 101 citedOpen Access
1.6 Tbps Silicon Photonics Integrated Circuit and 800 Gbps Photonic Engine for Switch Co-Packaging Demonstration
Journal of Lightwave Technology·2020· 144 cited
1.6Tbps Silicon Photonics Integrated Circuit for Co-Packaged Optical-IO Switch Applications
2020· 58 cited
A heterogeneously-integrated III-V/silicon interferometric widely tunable laser
2019· 1 cited
Supplement 1: High-resolution aliasing-free optical beam steering
Figshare·2017Open Access
High-resolution aliasing-free optical beam steering
Optica·2016· 521 citedOpen Access
Supplement 1: High-resolution aliasing-free optical beam steering
Figshare·2016Open Access
Supplement 1: High-resolution aliasing-free optical beam steering
Figshare·2016Open Access
Laser ablation of polyetheretherketone films for reversible wafer bonding
Journal of Laser Applications·2012· 3 cited
1310-nm Hybrid III–V/Si Fabry–Pérot Laser Based on Adhesive Bonding
IEEE Photonics Technology Letters·2011· 67 citedOpen Access
CMOS-compatible fabrication, micromachining, and bonding strategies for silicon photonics
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2011
A 4×12.5 Gb/s CWDM Si photonics link using integrated hybrid silicon lasers
2011· 24 cited
Die-to-Die Adhesive Bonding for Evanescently-Coupled Photonic Devices
ECS Transactions·2010· 18 citedOpen Access
Die-to-Die Adhesive Bonding for Evanescently-Coupled Photonic Devices
ECS Meeting Abstracts·2010· 1 cited
Demonstration of a High Speed 4-Channel Integrated Silicon Photonics WDM Link with Hybrid Silicon Lasers
Integrated Photonics Research, Silicon and Nanophotonics and Photonics in Switching·2010· 104 cited
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Frequent Co-authors

Richard Jones(10), Haisheng Rong(9), Ling Liao(7), J. K. Doylend(6), Saeed Fathololoumi(5), Kimchau N. Nguyen(5), Meer Sakib(5), Harel Frish(5), Yuliya Akulova(5), Ranjeet Kumar(4), Christopher T. Phare(4), David Hui(4), Hari Mahalingam(4), Reece Defrees(4), Daniel Zhu(4), Matthew N. Sysak(4), Valluri Rao(4), Andrew Alduino(3), Thomas Liljeberg(3), Mario Paniccia(3)