Larry Smith

Engineering · Physical Sciences

11h-index453citations46works0.02yr avg
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Research Topics

3D IC and TSV technologies(12), Electronic Packaging and Soldering Technologies(8), Semiconductor materials and devices(8), Copper Interconnects and Reliability(7), Integrated Circuits and Semiconductor Failure Analysis(6)

Publications46 total

Principles of Power Integrity for PDN Design:
2018· 25 cited
Novel Parallel Resonance Peak Measurement and Lossy Transmission Line Modeling of 2-T and 3-T MLCC Capacitors for PDN Application
2017· 3 cited
Measurement-Based Method for Decomposing PDN Matrix Loop Inductances
2016
SHORT LOOP ELECTRICAL AND RELIABILITY LEARNING FOR THROUGH SILICON VIA (TSV)MID-WAFER FRONT-SIDE PROCESSES
IMAPSource Proceedings·2014· 2 cited
Metrology Needs for 2.5D/3D Interconnects
2014· 1 cited
Metrology Needs for TSV Fabrication | NIST
Journal of Micro/Nanolithography MEMS and MOEMS·2014
Metrology needs for through-silicon via fabrication
Journal of Micro/Nanolithography MEMS and MOEMS·2014· 30 cited
Backside TSV protrusion induced by thermal shock and thermal cycling
2013· 30 cited
Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits
Journal of Electronic Testing·2011· 11 cited
On the technology and ecosystem of 3D / TSV manufacturing
2011· 12 cited
Accelerating Project and Process Improvement using Advanced Software Simulation Technology: From the Office to the Enterprise
2010
System power distribution network theory and performance with various noise current stimuli including impacts on chip level timing
2009· 32 cited
Through-Silicon Via Fabrication, Backgrind, and Handle Wafer Technologies
Integrated circuits and systems·2008· 4 cited
Electromigration behavior of 60 nm dual damascene Cu interconnects
Journal of Applied Physics·2007· 7 cited
Lane Departure Warning System Research and Test Development
20th International Technical Conference on the Enhanced Safety of Vehicles (ESV)National Highway Traffic Safety Administration·2007· 10 cited
FPGA Design for Signal and Power Integrity
2007· 10 cited
Yield considerations in the choice of 3D technology
2007· 45 cited
Effect of barrier process on electromigration reliability of Cu/porous low-k interconnects
Journal of Applied Physics·2006· 13 cited
Electrical Properties of Organic and Silicon Carbide Etch Stop Layers in Copper/Porous MSQ Structures
ECS Transactions·2006
Electrical Properties of Organic and Silicon Carbide Etch Stop Layers in Copper/Porous MSQ Structures
ECS Meeting Abstracts·2006Open Access
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Frequent Co-authors

Klaus Hummler(6), Klaus Pfeifer(5), Sharath Hosali(4), Donald E. Kizer(4), Victor Vartanian(4), Steve Olson(4), Brian Sapp(4), Donald O. Mack(4), Sitaram Arkalgud(3), Richard A. Allen(3), Jung Woo Pyun(3), Paul S. Ho(3), Kyle Neuman(3), G. C. Moore Smith(3), Vicki L. Reed(2), Won-Chong Baek(2), Jay Im(2), R.L. Emerson(2), Linda K. Nixon(2), Lizhi Zeng(2)